Related papers: Thermal analysis & optimization of a 3 dimensional…
Thermal Interface Materials (TIMs) are widely used in electronic packaging. Increasing power density and limited assembly space pose high demands on thermal management. Large cooling surfaces need to be covered efficiently. When joining the…
The thermal conductivity of Functionally Graded Materials (FGMs) can be efficiently designed through topology optimization to obtain thermal meta-structures that actively steer the heat flow. Compared to conventional analytical design…
Artificially designed composite materials consist of microstructures, that exhibit various thermal properties depending on their shapes, such as anisotropic thermal conductivity. One of the representative applications of such composite…
The true power of computational research typically can lay in either what it accomplishes or what it enables others to accomplish. In this work, both avenues are simultaneously embraced across several distinct efforts existing at three…
Functional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems. Therefore, information from different physical domains has to be…
3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal…
Analyzing data centers with thermal-aware optimization techniques is a viable approach to reduce energy consumption of data centers. By taking into account thermal consequences of job placements among the servers of a data center, it is…
Navigating the intricacies of thermal management at the quantum scale is a challenge in the pursuit of advanced nanoscale technologies. To this extent, theoretical frameworks introducing minimal models mirroring the functionality of…
Recent developments of the pump-probe thermoreflectance methods (such as the beam-offset and elliptical-beam approaches of the time-domain and frequency-domain thermoreflectance techniques) enabled measurements of the thermal conductivities…
In this article, a general model for 1D thermal wave interference is derived for multi-layered coating systems on a thermally thick substrate using the same principles as for the well established one-layered and two-layered coating cases.…
In this paper, we develop an optimization-based systematic approach for the challenging, less studied, and important problem of optimal partitioning of multi-thermal zone buildings for the decentralized control. The proposed method consists…
The increasing electricity use and reliance on intermittent renewable energy sources challenge power grid management during peak demand, making Demand Response programs and energy conservation measures essential. This research combines…
Virtual Data Center (VDC) embedding has drawn significant attention recently because of growing need for efficient and flexible means of Data Center (DC) resource allocation. Existing studies on VDC embedding mainly focus on improving DCs'…
The existed theories and methods for calculating interfacial thermal conductance of solid-solid interface lead to diverse values that deviate from experimental measurements. In this letter, We propose a model to estimate the ITC at high…
The environmental impact of Large Language Models (LLMs) on data centers hosting these models is becoming a significant concern. While many efforts have focused on reducing the substantial training overhead of LLMs, carbon and water…
In this paper we evaluate the use of system identification methods to build a thermal prediction model of heterogeneous SoC platforms that can be used to quickly predict the temperature of different configurations without the need of…
During the earliest phase of architectural design process, practitioners after analyzing the client's design program, legal requirements, topographic constraints, and preferences synthesize these requirements into architectural floor plan…
We explore layered strongly correlated materials as a platform to identify and control unconventional heat transfer phenomena. We demonstrate that these systems can be tailored to sustain a wide spectrum of heat transport regimes, ranging…
Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring…
A thermoelectric device is a heat engine that directly converts heat into electricity. Many materials with a high figure of merit ZT have been discovered in anticipation of a high thermoelectric efficiency. However, there has been a lack of…