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Current infrared and visible image fusion (IVIF) methods go to great lengths to excavate complementary features and design complex fusion strategies, which is extremely challenging. To this end, we rethink the IVIF outside the box,…

We present the results of the characterization of novel n-in-p planar pixel detectors, designed for the future upgrades of the ATLAS pixel system. N-in-p silicon devices are a promising candidate to replace the n-in-n sensors thanks to…

Leveraging multi-modal fusion, especially between camera and LiDAR, has become essential for building accurate and robust 3D object detection systems for autonomous vehicles. Until recently, point decorating approaches, in which point…

We report on two edge-coupling and power splitting devices for hybrid integration of III-V lasers with sub-micrometric silicon-on-insulator (SOI) waveguides. The proposed devices relax the horizontal alignment tolerances required to achieve…

Infrared and visible image fusion (IVIF) is increasingly applied in critical fields such as video surveillance and autonomous driving systems. Significant progress has been made in deep learning-based fusion methods. However, these models…

3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are…

For the high luminosity phase of the Large Hadron Collider to start operation around 2026, a major upgrade of the ATLAS Inner Tracker (ITk) is in preparation. Thanks to their low power dissipation and high charge-collection efficiency after…

CMOS Pixel Sensors are making steady progress towards the specifications of the ILD vertex detector. Recent developments are summarised, which show that these devices are close to comply with all major requirements, in particular the…

Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk…

The transition towards designs which co-package electronic and photonic die together in data center switch packages has created a scaling path to Petabyte per second (Pbps) input/output (I/O) in such systems. In a co-packaged design, the…

In order to meet the requirements of the High Luminosity LHC (HL-LHC), it will be necessary to replace the current tracker of the ATLAS experiment. Therefore, a new all-silicon tracking detector is being developed, the so-called Inner…

Silicon photonic devices are poised to enter high volume markets such as data-communications, telecommunications, biological sensing, and optical phased arrays; however, permanently attaching a fiber to the photonic chip with high optical…

This work presents a novel solution for the packaging of ALPIDE chips that facilitates non-planar assembly with a minimal material budget. This solution represents a technological advancement based on methodologies developed for the ALICE…

For operation at the High Luminosity Large Hadron Collider (LHC), the ATLAS experiment is building a new all-silicon inner tracker (ITk). The production and testing of thousands of silicon pixel and strip modules is required to cover the…

Achieving high performance, energy efficiency, and cost-effectiveness while maintaining architectural flexibility is a critical challenge in the development and deployment of edge AI devices. Monolithic SoC designs struggle with this…

In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the dual-sided Monolithic 3D (M3D). Based on…

We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the…

In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area…

Camera and 3D LiDAR sensors have become indispensable devices in modern autonomous driving vehicles, where the camera provides the fine-grained texture, color information in 2D space and LiDAR captures more precise and farther-away distance…

Sensor fusion has become a popular topic in robotics. However, conventional fusion methods encounter many difficulties, such as data representation differences, sensor variations, and extrinsic calibration. For example, the calibration…