Related papers: Integrated Circuit Readout for the Silicon Sensor …
The MIDNA application specific integrated circuits (ASICs) are a series of skipper-CCD readout chips fabricated in a 65 nm low-power CMOS process that implement a correlated double sampling signal processing chain based on dual-slope…
We measure charge transport in hydrogenated amorphous silicon (a-Si:H) using a nanometer scale silicon MOSFET as a charge sensor. This charge detection technique makes possible the measurement of extremely large resistances. At high…
This paper demonstrates the use of voltage noise thermometry, with a cross-correlation technique, as a dissipation-free method of thermometry inside a CMOS integrated circuit (IC). We show that this technique exhibits broad agreement with…
The development of CMOS pixel sensors with column parallel read-out and integrated zero-suppression has resulted in a full size, nearly 1 Megapixel, prototype with ~100 \mu s read-out time. Its performances are quite close to the ILD vertex…
3D silicon sensors, where plasma micro-machining is used to etch deep narrow apertures in the silicon substrate to form electrodes of PIN junctions, represent possible solutions for inner pixel layers of the tracking detectors in high…
Recent studies of silicon spin qubits at temperatures above 1 K are encouraging demonstrations that the cooling requirements for solid-state quantum computing can be considerably relaxed. However, qubit readout mechanisms that rely on…
Three key metrics for readout systems in quantum processors are measurement speed, fidelity and footprint. Fast high-fidelity readout enables mid-circuit measurements, a necessary feature for many dynamic algorithms and quantum error…
In the passive CMOS Strips Project, strip sensors were designed at the University of Bonn and produced by LFoundry in 150 nm technology, with an additional backside processing from IZM Berlin. Up to five individual reticules were connected…
Calorimeters with silicon detectors have many unique features and are proposed for several world-leading experiments. We describe the R&D program of the large scale detector element with up to 12 000 readout channels for the International…
The technological prototype of the CALICE highly granular silicon-tungsten electromagnetic calorimeter (SiW-ECAL) was tested in a beam at DESY in 2017. The setup comprised seven layers of silicon sensors. Each layer comprised four sensors,…
The Skipper-in-CMOS image sensor integrates the non-destructive readout capability of Skipper Charge Coupled Devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode in a CMOS imaging process, while taking advantage of…
Bacteria sense a diverse range of environmental analytes with high sensitivity and temporal resolution. Engineering and synthetic biology approaches enabled harnessing this capability through development of whole-cell biosensors that…
We present the electro-thermal characterization of transition-edge sensor (TES) detectors suspended on Si membranes fabricated using a silicon-on-insulator (SOI) wafer. The use of an all-silicon fabrication platform, in contrast to the more…
This paper presents experimental and simulation data to characterize the Ring Oscillators (RO) produced in 65-nm CMOS technology for the next promising generation of readout chips for the pixel detector in the Inner Tracker (ITk) at the…
While designed primarily for X-ray imaging applications, the Medipix3 ASIC can also be used for charged-particle tracking. In this work, results from a beam test at the CERN SPS with irradiated and non-irradiated sensors are presented and…
The 4th detector is rich in particle identification measurements from the dual-readout calorimeters, the cluster-timing tracking chamber, the muon spectrometer, and combinations of these systems. In all, a total of 13 measurements…
The motivation of the current R&D project is based upon the requirements of the JEDI international collaboration aiming to measure Electric Dipole Moments (EDMs) of charged particles in storage rings. One of the most important elements of…
We study how single-qubit dispersive readout works alongside two qubit coupling. To make calculations analytically tractable, we use a simplified model which retains core characteristics of but is discretised compared to dispersive homodyne…
We describe a highly-integrated CMOS transceiver for active structural health monitoring (SHM). The chip actuates piezoelectric transducers and also senses ultrasound waves received by the same or another transducer. The transmitter uses an…
Complementary-metal-oxide-semiconductor (CMOS) is the most widely spread technology for integrated circuits fabrication. Each foundry offers different technology nodes that are characterized by the minimum feature size, which is the…