Related papers: Reflow Soldering of Surface Mount Electronic Compo…
The iterative prototyping process for printed circuit boards (PCBs) frequently employs surface-mounted device (SMD) components, which are often discarded rather than reused due to the challenges associated with desoldering, leading to…
Surface mount technology (SMT) is an enhanced method in electronic packaging in which electronic components are placed directly on soldered printing circuit board (PCB) and are permanently attached on PCB with the aim of reflow soldering…
The placed electronic component can shift on the wet solder paste in pick and place (P&P) process of surface mount technology (SMT). It does not usually attract much attention, because the shift is considered to be negligibly small and the…
System-level design, once the province of board designers, has now become a central concern for chip designers. Because chip design is a less forgiving design medium -- design cycles are longer and mistakes are harder to correct --…
The recent advances in the area of design obfuscation are encouraging, but may present themselves as hard to read for a non-specialist audience. This tutorial uncovers these advances in a clear language, contrasting the approaches that can…
Typical design flows are hierarchical and rely on assembling many individual technology elements from standard cells to complete boards. Providers use compact models to provide simplified views of their products to their users. Designers…
We present, SurfCuit, a novel approach to design and construction of electric circuits on the surface of 3D prints. Our surface mounting technique allows durable construction of circuits on the surface of 3D prints. SurfCuit does not…
We review recent progress at the Centre for Cold Matter in developing atom chips. An important advantage of miniaturizing atom traps on a chip is the possibility of obtaining very tight trapping structures with the capability of…
In pick and place (P&P) process of surface mount technology (SMT) the placed component can shift from its ideal (or designed) position on the wet solder paste. The solder paste with some fluid properties could slump and the unbalance…
Sintering, as a thermal process at elevated temperature below the melting point, is widely used to bond contacting particles into engineering products such as ceramics, metals, polymers, and cemented carbides. Modelling and simulation as…
In surface mount technology (SMT), mounted components on soldered pads are subject to move during reflow process. This capability is known as self-alignment and is the result of fluid dynamic behaviour of molten solder paste. This…
Carefully tested electric/electronic components are a requirement for effective hardware-in-the-loop tests and vehicle tests in automotive industry. A new method for definition and execution of component tests is described. The most…
As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic Au-Sn alloy was used in this study. Using a co-electroplating process, it was possible to plate the Au-Sn solder…
A key challenge in performing experiments with microparticles is controlling their adhesion to substrates. For example, levitation of a microparticle initially resting on a surface requires overcoming the surface adhesion forces to deliver…
Carrying digital information in traditional copper wires is becoming a major issue in electronic circuits. Optical connections such as fiber optics offers unprecedented transfer capacity, but the mismatch between the optical wavelength and…
In MEMS technology, most of the devices are fabricated on glass or silicon substrate. However, this research presents a novel manufacture method that is derived from conventional hot embossing technology to fabricate the electrostatic…
Acoustic tweezers comprising a surface acoustic wave chip and a disposable silicon microfluidic chip are potentially advantageous to stable and cost-ffective acoustofluidic experiments while avoiding the cross-contamination by reusing the…
We report on the development of some process capabilities for a polymer-based, multi-layer microelectrofluidic platform, namely: the hot embossing process, metallization on polymer and polymer bonding. Hot embossing experiments were…
Some years ago we have proposed a thermal mount with electronically variable thermal resistance [1]. In this earlier work the feasibility of such a structure has been demonstrated. Now we intend to realize this mount in a maturated form,…
Electronic waste (e-waste) is a growing global challenge, with millions of functional components discarded due to the difficulty of repair and reuse. Traditional circuit assembly relies on soldering, which creates semi-permanent bonds that…