Design issues of a variable thermal resistance
Materials Science
2007-09-13 v1
Abstract
Some years ago we have proposed a thermal mount with electronically variable thermal resistance [1]. In this earlier work the feasibility of such a structure has been demonstrated. Now we intend to realize this mount in a maturated form, suitable to the everyday use in the practice of package thermal qualification and modeling. The design of such a device raises a number of new questions and problems. The present paper is dealing with these problems and the possible solutions.
Cite
@article{arxiv.0709.1836,
title = {Design issues of a variable thermal resistance},
author = {V. Szekely and G. Mezosi},
journal= {arXiv preprint arXiv:0709.1836},
year = {2007}
}
Comments
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