Related papers: Package Hermeticity Testing with Thermal Transient…
Depending on the type of Micro-Electro-Mechanical System (MEMS), packaging costs are contributing up to 80% of the total device cost. Each MEMS device category, its function and operational environment will individually dictate the…
This paper analyzes a transient method for the characterization of low-resistance thermal interfaces of microelectronic packages. The transient method can yield additional information about the package not available with traditional static…
The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more…
Over the last decade the successful design and fabrication of complex MEMS (MicroElectroMechanical Systems), optical circuits and ASICs have been demonstrated. Packaging and integration processes have lagged behind MEMS research but are…
A safety verification task involves verifying a system against a desired safety property under certain assumptions about the environment. However, these environmental assumptions may occasionally be violated due to modeling errors or…
A new testing apparatus is proposed to measure the thermal properties of fabrics made from polymeric materials. The calibration of the apparatus and the data acquisition procedure are considered in detail in order to measure thermal…
Microelectromechanical systems (MEMS) gyroscopes are widely used, e.g. in modern automotive and consumer applications, and require signal stability and accuracy in rather harsh environmental conditions. In many use cases, device reliability…
Active thermal control is crucial in achieving the required accuracy and throughput in many industrial applications, e.g., in the medical industry, high-power lighting industry, and semiconductor industry. Thermoelectric Modules (TEMs) can…
Printed sensors represent a transformative advancement in sensor technology, utilizing innovative printing techniques to create flexible, cost-effective, and highly customizable sensing devices. Their versatility allows integration into…
Recently the strong demands in wireless communication requires expanding development for the application of RF MEMS (Radio Frequency micro electro mechanical systems) sensing devices such as micro-switches, tunable capacitors because it…
Modern precision manufacturing faces the challenge of integrating accuracy requirements into a framework of agile and sustainable production technologies. This development leads to numerous further challenges, affecting almost all areas of…
Our paper presents a non-destructive thermal transient measurement method that is able to reveal differences even in the micron size range of MEMS structures. Devices of the same design can have differences in their sacrificial layers as…
The integration of Industrial Internet of Things (IIoT) devices into manufacturing environments has accelerated the transition to Industry 4.0, but has also introduced new cybersecurity risks. This paper conducts a comprehensive security…
Thermal FEM (Finite Element Method) simulations can be used to predict the thermal behavior of power semiconductors in application. Most power semiconductors are made of silicon. Silicon thermal material properties are significantly…
Integrated optical electric field sensors (IOES) play a crucial role in electric field measurement. This paper introduces the principles of the IOES and quantitatively evaluates the impact of humidity on measurement accuracy. Sensors with…
The majority of microelectromechanical system (MEMS) devices must be combined with integrated circuits (ICs) for operation in larger electronic systems. While MEMS transducers sense or control physical, optical or chemical quantities, ICs…
A new type of integrated temperature and humidity sensor applying LTCC-technology has been developed and characterized. In this approach, sensing elements are implemented using heated metal resistors (Pt-elements), where one is exposed to…
Silicon microelectronics, consisting of complementary metal oxide semiconductor (CMOS) technology, have changed nearly all aspects of human life from communication to transportation, entertainment, and healthcare. Despite the widespread and…
State-of-the-art magnetic field measurements performed in shielded environments with carefully controlled conditions rarely reflect the realities of those applications envisioned in the introductions of peer-reviewed publications.…
The use of embedded software is advancing in modern medical devices, so does its capabilities and complexity. This paradigm shift brings many challenges such as an increased rate of medical device failures due to software faults. In this…