Related papers: High Aspect Pattern Formation by Integration of Mi…
Low Temperature Cofired Ceramics (LTCC) has been a popular multi layer ceramic (MCM) packaging material for many electronic applications. The main advantage with LTCC would be its ability to embed a major part of the electronic circuit…
We demonstrate for the first time controlled patterning by inducing nucleation of material from a dense aqueous dispersion or solution in an optical tweezers. A hot spot is formed on a glass surface by the trapping laser due to which a…
This work addresses the fabrication of transparent glass surfaces with superior water-repellence (i.e., superhydrophobicity), and related functional properties such as omniphobicity, anti-fogging and anti-icing responses. Surfaces have been…
Light-based additive manufacturing holds great potential in the field of bioprinting due to its exceptional spatial resolution, enabling the reconstruction of intricate tissue structures. However, printing through biological tissues is…
The future success of integrated circuits (IC) technology relies on the continuing miniaturization of the feature size, allowing more components per chip and higher speed. Extreme anisotropy opens new opportunities for spatial pattern…
Additive microfabrication processes based on localized electroplating enable the one-step deposition of micro-scale metal structures with outstanding performance, e.g. high electrical conductivity and mechanical strength. They are therefore…
Applications such as augmented and virtual reality (AR/VR), optical atomic clocks, and quantum computing require photonic integration of (near-)visible laser sources to enable commercialization at scale. The heterogeneous integration of…
Multilayer van der Waals (vdW) heterostructures have become an important platform in which to study novel fundamental effects emerging at the nanoscale. Standard nanopatterning techniques relying on electron-beam lithography and reactive…
Chalcogenide material-based integrated photonic devices have garnered widespread attention due to their unique wideband transparency. Despite their recognized CMOS compatibility, the fabrication of these devices relies predominantly on…
Heterogeneous and monolithic integration of the versatile low loss silicon nitride platform with low temperature materials such as silicon electronics and photonics, III-V compound semiconductors, lithium niobate, organics, and glasses, has…
Quantum lithography achieves phase super-resolution using fragile, experimentally challenging entangled states of light. We propose a scalable scheme for creating features narrower than classically achievable, with reduced use of quantum…
We present an approach to fabrication and packaging of integrated photonic devices that utilizes waveguide and detector layers deposited at near-ambient temperature. All lithography is performed with a 365 nm i-line stepper, facilitating…
Reliable and precise etching of silicon nanostructures with ultra-high aspect ratios is required in many fields. Metal assisted chemical etching (MacEtch) in vapor is a plasma-free etching method that attracts considerable attention owing…
The most direct definition of a patterning process' resolution is the smallest half-pitch feature it is capable of transferring onto the substrate. Here we demonstrate that thermal Scanning Probe Lithography (t-SPL) is capable of…
Silicon nanostructuring imparts unique material properties including antireflectivity, antifogging, anti-icing, self-cleaning, and/or antimicrobial activity. To tune these properties however, a good control over features size and shape is…
Mesa- and trench-patterned surfaces of 4H-SiC(0001) 4{\textdegree}off wafers were structured in macrosteps using Si melting in a SiC-Si-SiC sandwich configuration. Si spreading difficulties were observed in the case of trench-patterned…
Manufacturing electronic devices by printing techniques with low temperature sintering of nano-size material particles can revolutionize the electronics industry in coming years. The impact of this change to the industry can be significant…
We present results of a planar process development based on the combination of electron-beam lithography and dry etching for fabricating high-quality superconducting photosensitive structures in the sub-100nm regime. The devices were…
Insect-inspired capillary submicron stamping and subsequent surface-limited metal-assisted chemical etching (MACE) with ammonium bifluoride as HF source is employed for high-throughput production of ordered topographically patterned silicon…
Microscale additive manufacturing of reflective copper is becoming increasingly important for microelectronics and microcomputers, due to its excellent electrical and thermal conductivity. Yet, it remains challenging for state-of-the-art…