Related papers: Contactless Thermal Characterization of High Tempe…
The rising availability of large volume data, along with increasing computing power, has enabled a wide application of statistical Machine Learning (ML) algorithms in the domains of Cyber-Physical Systems (CPS), Internet of Things (IoT) and…
Accurate on-chip temperature sensing is critical for the optimal performance of modern CMOS integrated circuits (ICs), to understand and monitor localized heating around the chip during operation. The development of quantum computers has…
Power consumption and heat dissipation become key elements in the field of high-end integrated circuits, especially those used in mobile and high-speed applications, due to their increase of transistor count and clock frequencies. Dynamic…
The aim of this study was to evaluate and compare temperature distributions for different tissues being treated at the time of interstitial microwave hyperthermia. A coaxial-slot antenna implemented into the tissue is the source of…
Thermal conditions in the LTP, the LISA Technology Package, are required to be very stable, and in such environment precision temperature measurements are also required for various diagnostics objectives. A sensitive temperature gauging…
Accurate characterization of thermal emitters can be challenging due to the presence of background thermal emission from components of the experimental setup and the surrounding environment. This is especially true for an emitter operating…
The emerging field of phase-coherent caloritronics (from the Latin word "calor", i.e., heat) is based on the possibility to control heat currents using the phase difference of the superconducting order parameter. The goal is to design and…
Computing-in-Memory (CiM) is a promising paradigm to address the memory bottleneck constraining traditional systems. Most power-efficient CiM variants can directly perform Boolean operations in non-volatile memory arrays. Higher…
The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture…
Structural system identification in the presence of thermal loads is challenging, as unmeasured or poorly modeled thermal effects can mask or mimic damage, leading to unreliable conclusions. This work presents an optimization-driven,…
Temperature estimation, known as thermometry, is a critical sensing task for physical systems operating in the quantum regime. Indeed, thermal fluctuations can significantly degrade quantum coherence. Therefore, accurately determining the…
The packing of elastic sheets is investigated in a quasi two-dimensional experimental setup: a sheet is pulled through a rigid hole acting as a container, so that its configuration is mostly prescribed by the cross-section of the sheet in…
We present a method for the measurement of a temperature differential across a single quantum dot that has transmission resonances that are separated in energy by much more than the thermal energy. We determine numerically that the method…
The thermal response function given to a unit-step dissipation accurately characterizes the thermal system. Instead of the thermal response function the so-called structure function describing three-dimensional as the equivalent model of…
Temperature measurement with nano-Kelvin resolution is demonstrated at room temperature, based on the thermal dependence of an optical crystal anisotropy in a high quality whispering gallery resonator. As the resonator's TE and TM modes…
Thermal energy storage (TES) is increasingly recognized as an essential component of efficient Combined Heat and Power (CHP), Concentrated Solar Power (CSP), Heating Ventilation and Air Conditioning (HVAC), and refrigeration as it reduces…
This paper demonstrates the use of voltage noise thermometry, with a cross-correlation technique, as a dissipation-free method of thermometry inside a CMOS integrated circuit (IC). We show that this technique exhibits broad agreement with…
One of the main advantages expected from using quantum probes as thermometers is non invasiveness, i.e., a negligible perturbation to the thermal sample. However, invasiveness is rarely investigated explicitly. Here, focusing on a…
We report on a non-interacting technique for thermal characterization of fluids based on surface plasmon resonance interrogation. Using liquid volumes less than 20 micro liters we have determined the materials' thermo-optic coefficients…
We present mechanical measurements performed at low temperatures on cantilever-based microelectro-mechanicalstructures(MEMS) coated with a metallic layer. Two very different coatings are presented in order to illustrate the capabilities of…