Related papers: An Integrated Circuit Compatible Compact Package f…
Thermal management is an important challenge in modern electronics, avionics, automotive, and energy storage systems. While passive thermal solutions (like heat sinks or heat spreaders) are often used, actively modulating heat flow (e.g.…
An innovative and accurate dynamic Compact Thermal Model extraction method is proposed for multi-chip power electronics systems. It accounts for thermal coupling between multiple heat sources. Transient electro-thermal coupling can easily…
A sampling calorimeter equipped with gaseous sensor layers with digital readout is near perfect for "Particle Flow Algorithm" approach, since it is homogeneous over large surfaces, robust, cost efficient, easily segmentable to any readout…
Frequently, the design of physicochemical processes requires screening of large numbers of alternative designs with complex geometries. These geometries may result in conformal meshes which introduce stability issues, significant…
While parallel microchannel based cooling systems have been around for quite a period of time, employing the same and incorporating them for near active cooling of microelectronic devices is yet to be implemented and the implications of the…
This article introduces a thin-film thermocouple temperature sensor with symmetrical electrode structure. It uses PI film as a flexible substrate. Cu film and CuNi film made by MEMS manufacturing process as positive and negative electrodes.…
We propose a novel solid-fluid interaction method for coupling elastic solids with impulse flow maps. Our key idea is to unify the representation of fluid and solid components as particle flow maps with different lengths and dynamics. The…
Various chips for the silicon sensors measurements are described. These chips are based on 0.35 um and 0.18um CMOS technology. Several analog chips together with self-trigger /derandomizer one allow to measure silicon sensors designed for…
The development of lightweight flex PCBs and nanowire-based thermal interfaces for low-mass, high-performance detector modules are presented. A novel manufacturing approach targeting flex circuits with double-sided pad access, assembled…
A novel microfabricated, all-electrical measurement platform is presented for a direct, accurate and rapid determination of the thermal conductivity and diffusivity of liquid and solid materials. The measurement approach is based on the…
We present an experimental unit that realizes the ``multi-input, multi-output manifold'' thermal management technology proposed by Lamarre & Raymond (2023). The proposed setup can be used for experiments aimed at controlling spatiotemporal…
This work addresses the simulation of heat flow and electric currents in thin wires. An important application is the use of bond wires in microelectronic chip packaging. The heat distribution is modeled by an electrothermal coupled problem,…
Thermal Desktop (TD) is an industry-standard thermal analysis tool used to create and analyze thermal models for landers, rovers, spacecraft, and instrument payloads. Currently, limited software exists to extract and visualize metrics…
A novel direct approach to detect the resin flow front during the Liquid Resin Infusion process under industrial environment is proposed. To detect the resin front accurately and verify the results, which are deduced from indirect…
A new cryogenic packaging methodology that is widely applicable to packaging any integrated photonics circuit for operation at both room temperature and cryogenic temperature is reported. The method requires only equipment and techniques…
Thermal energy storage using sensible heating of a solid storage medium is a potential low-cost technology for long-duration energy storage. To effectively get heat in and out of the solid material, channels of heat transfer fluid can be…
An inertial sensor design is proposed in this paper to achieve high sensitivity and large dynamic range in the sub-Hz frequency regime. High acceleration sensitivity is obtained by combining optical cavity readout systems with…
Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…
Tactile sensing plays a fundamental role in enabling robots to navigate dynamic and unstructured environments, particularly in applications such as delicate object manipulation, surface exploration, and human-robot interaction. In this…
The paper aims at demonstrating communication capabilities of IPT. For this data communication is performed between two modules using the concept of IPT. IPT was deemed to be the best solution to the system houses a multi parameter…