Related papers: CIX - A Detector for Spectral Enhanced X-ray Imagi…

The physics aims at the proposed future CLIC high-energy linear $e^+ e^-$ collider pose challenging demands on the performance of the detector system. In particular the vertex and tracking detectors have to combine precision measurements…

When an X-ray is incident onto the silicon absorber array of a detector, it liberates a large number of electrons, which tend to diffuse outward into what is referred to as the charge cloud. This number can vary from tens to thousands…

Optical interconnects are becoming attractive alternatives to electrical wiring in intra- and inter-chip communication links. Particularly, the integration with silicon complementary metal-oxide-semiconductor (CMOS) technology has received…

A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to…

Today, most X-ray pixel detectors used at light sources transmit raw pixel data off the detector ASIC. With the availability of more advanced ASIC technology nodes for scientific application, more digital functionality from the computing…

Active Pixel Sensor (APS) technology has shown promise for next-generation vertex detectors. This paper discusses the design and testing of two generations of APS chips. Both are arrays of 128 by 128 pixels, each 20 by 20 micro-m. Each…

Within the ATTRACT FASTPIX project, a monolithic pixel sensor demonstrator chip has been developed in a modified 180 nm CMOS imaging process technology, targeting sub-nanosecond timing precision for single ionising particles. It features a…

Multichip modules (MCM) with 4 single photon counting MPEC 2.3 chips bump bonded to 1.3 cm x 1.3 cm large CdTe and Si semiconductor sensors as well as to single chip pixel detectors have been successfully built and operated. The MPEC 2.3…

Pixel Array Detectors (PADs) consist of an x-ray sensor layer bonded pixel-by-pixel to an underlying readout chip. This approach allows both the sensor and the custom pixel electronics to be tailored independently to best match the x-ray…

The Pixel 2010 conference focused on semiconductor pixel detectors for particle tracking/vertexing as well as for imaging, in particular for synchrotron light sources and XFELs. The big LHC hybrid pixel detectors have impressively started…

Integrated circuits based on CMOS (complementary metal-oxide semiconductors) are at the heart of the technological revolution of the past 40 years, as these have enabled compact and low cost micro-electronic circuits and imaging systems.…

To take advantage of high-resolution optics sensitive to a broad energy range, future X-ray imaging instruments will require thick detectors with small pixels. This pixel aspect ratio affects spectral response in the soft X-ray band, vital…

Integration is currently the only feasible route towards scalable photonic quantum processing devices that are sufficiently complex to be genuinely useful in computing, metrology, and simulation. Embedded on-chip detection will be critical…

In order to fully exploit the physics potential of the future high energy e+ e- linear collider, a Vertex Tracker providing high resolution track reconstruction is required. Hybrid pixel sensors are an attractive technology due to their…

In quantum illumination, various detection schemes have been proposed for harnessing remaining quantum correlations of the entanglement-based resource state. To this date, the only successful implementation in the microwave domain relies on…

A spectrometer for resonant inelastic X-ray scattering (RIXS) is proposed where imaging and dispersion actions in two orthogonal planes are combined to deliver full two-dimensional map of RIXS intensity in one shot with parallel detection…

To detect tracks of charged particles close to the interaction point in high energy physics experiments of the next generation colliders, hybrid pixel detectors, in which sensor and read-out IC are separate entities, constitute the present…

The integrated optical circuit is a promising architecture for the realization of complex quantum optical states and information networks. One element that is required for many of these applications is a high-efficiency photon detector…

CMOS sensors were successfully implemented in the STAR tracker [1]. LHC experiments have shown that efficient b tagging, reconstruction of displaced vertices and identification of disappearing tracks are necessary. An improved vertex…

The concept of capacitive coupling between sensors and readout chips is under study for the vertex detector at the proposed high-energy CLIC electron positron collider. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is an active…