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Multimode interference reflectors (MIRs) were recently introduced as a new type of photonic integrated devices for on-chip, broadband light reflection. In the original proposal, different MIRs were demonstrated based on total internal…
This paper describes a 2D and 3D simulation engine that quantitatively models the statics, dynamics, and non-linear deformation of heterogeneous soft bodies in a computationally efficient manner. There is a large body of work simulating…
Two-dimensional (2D) materials family with its many members and different properties has recently drawn great attention. Thanks to their atomic thickness and smooth surface, 2D materials can be constructed into heterostructures or…
Tactile sensors have a wide range of applications, from utilization in robotic grippers to human motion measurement. If tactile sensors could be fabricated and integrated more easily, their applicability would further expand. In this study,…
It may be possible to reinvent how microelectronics are made using a two step process: (1) Synthesizing modular, nanometer-scale components -- transistors, sensors, and other devices -- and suspending them in a liquid "ink" for storage or…
We have fabricated a custom cryogenic Complementary Metal-Oxide-Semiconductor (CMOS) integrated circuit that has a higher measurement bandwidth compared with conventional room temperature electronics. This allowed implementing single shot…
Due to the increased deployment of renewable energy sources and intelligent components the electric power system will exhibit a large degree of heterogeneity, which requires inclusive and multi-disciplinary system assessment. The concept of…
High-fidelity numerical methods that model the physical layout of a device are essential for the design of many technologies. For methods that characterize electromagnetic effects, these numerical methods are referred to as computational…
The combination of theory and simulation is necessary in the investigation of properties of complex systems where each method alone cannot do the task properly. Theory needs simulation to test ideas and to check approximations. Simulation…
Aside from recent advances in artificial intelligence (AI) models, specialized AI hardware is crucial to address large volumes of unstructured and dynamic data. Hardware-based AI, built on conventional complementary metal-oxidesemiconductor…
Stacked intelligent metasurface (SIM) is an emerging technology that capitalizes on reconfigurable metasurfaces for several applications in wireless communications. SIM is considered an enabler for integrating communication, sensing and…
This paper presents a method to simulate the thermal behavior of 3D systems using a graph neural network. The method discussed achieves a significant speed-up with respect to a traditional finite-element simulation. The graph neural network…
Natural human interactions for Mixed Reality Applications are overwhelmingly multimodal: humans communicate intent and instructions via a combination of visual, aural and gestural cues. However, supporting low-latency and accurate…
Thermal FEM (Finite Element Method) simulations can be used to predict the thermal behavior of power semiconductors in application. Most power semiconductors are made of silicon. Silicon thermal material properties are significantly…
Silicon is an excellent material for microelectronics and integrated photonics with untapped potential for mid-IR optics. Despite broad recognition of the importance of the third dimension, current lithography methods do not allow…
Microelectromechanical systems (MEMS) resonators serve as frequency selective components in applications ranging from biology to communications. In this paper, the dynamic behavior of an RF MEMS disk resonator is formulated using an…
To investigate order-order interfaces, we perform multimagnetical Monte Carlo simulations of the $2D$ and $3D$ Ising model. Stringent tests of the numerical methods are performed by reproducing with high precision exact $2D$ results. In the…
Working in a three-dimensional variant of Winfree's abstract Tile Assembly Model, we show that, for an arbitrary finite, connected shape $X \subset \mathbb{Z}^2$, there is a tile set that uniquely self-assembles into a 3D representation of…
This paper presents the design of the MuPIF distributed, multi-physics simulation platform and its performance in the context of the H2020 Composelector project. The description of MuPIF's model and data interfaces provides implementation…
The growing complexity of cyber-physical systems, particularly in automotive applications, has increased the demand for efficient modeling and cross-domain co-simulation techniques. While SystemC Transaction-Level Modeling (TLM) enables…