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We report the development of a cryogenic powder filter that simultaneously offers high attenuation of radio-frequency (RF) signals in the gigahertz (GHz) range and minimized parasitic capacitance to ground. Conventional powder filters,…
In this paper, we propose a novel multiscale model reduction strategy tailored to address the Poisson equation within heterogeneous perforated domains. The numerical simulation of this intricate problem is impeded by its multiscale…
This work introduces ParAMS -- a versatile Python package that aims to make parameterization workflows in computational chemistry and physics more accessible, transparent and reproducible. We demonstrate how ParAMS facilitates the parameter…
This article presents several design techniques to fabricate micro-electro-mechanical systems (MEMS) using standard complementary metal-oxide semiconductor (CMOS) processes. They were applied to fabricate high yield CMOS-MEMS shielded…
This paper considers a developing theory on the effects of inevitable process variations during the fabrication of MEMS and other microsystems. The effects on the performance and design yield of the microsystems devices are analyzed and…
We propose the design of a reconfigurable impedance matching network for the lower RF frequency band, based on a developed RF-MEMS technology. The circuit is composed of RF-MEMS ohmic relays, metal-insulator-metal (MIM) capacitors and…
Due to their high force sensitivity, mechanical resonators combining low mechanical dissipation with a small motional mass are highly demanded in fields as diverse as resonant force imaging, mass sensing, or cavity optomechanics.…
Rydberg-atom electrometry, as an emerging cutting-edge technology, features high sensitivity, broad bandwidth, calibration-free operation, and beyond. However, until now the key atomic vapor cells used for confining electric field-sensitive…
In this paper, we present a Constraint Energy Minimizing Generalized Multiscale Finite Element Method (CEM-GMsFEM) for parabolic equations with multiscale coefficients, arising from applications in porous media. We will present the…
The alignment of the frontier orbital energies of an adsorbed molecule with the substrate Fermi level at metal-organic interfaces is a fundamental observable of significant practical importance in nanoscience and beyond. Typical density…
A model for a MEMS device, consisting of a fixed bottom plate and an elastic plate, is studied. It was derived in a previous work as a reinforced limit when the thickness of the insulating layer covering the bottom plate tends to zero. This…
The maturity of the chemical vapor deposition graphene-based device processing has increased from chip level demonstrations to wafer-scale fabrication in the past few years. Due to this wafer-scale, electrical characterization and analysis…
Stacked intelligent metasurfaces (SIMs) extend the concept of reconfigurable intelligent surfaces by cascading multiple programmable layers, enabling advanced electromagnetic wave transformations for communication and sensing applications.…
Two-dimensional materials (2DMs) are a promising alternative to complement and upgrade high-frequency electronics. However, in order to boost their adoption, the availability of numerical tools and physically-based models able to support…
Sensors and actuators based on resonant micro-electro-mechanical systems (MEMS), such as scanning micro mirrors, are well-established in automotive and consumer products. As the areas of application broaden, the requirements for the MEMS…
Carbon fiber composite can be a potential candidate for replacing metal-based battery enclosures of current electric vehicles (E.V.s) owing to its better strength-to-weight ratio and corrosion resistance. However, the strength of carbon…
FeFETs hold strong potential for advancing memory and logic technologies, but their inherent randomness arising from both operational cycling and fabrication variability poses significant challenges for accurate and reliable modeling.…
In recent years, interfacial fracture becomes one of the most important problems in the assessment of reliability of electronics packaging. Especially, underfill resin is used with solder joints in flip chip packaging for preventing the…
Leveraging the latent heat of phase change materials (PCMs) can reduce the peak temperatures and transient variations in temperature in electronic devices. But as the power levels increase, the thermal conduction pathway from the heat…
Despite the enormous progress achieved during the past decade, nanoelectronic devices based on two-dimensional (2D) semiconductors still suffer from a limited electrical stability. This limited stability has been shown to result from the…