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We study the thermal conductance across solid-solid interfaces as the composition of an intermediate matching layer is varied. In absence of phonon-phonon interactions, an added layer can make the interfacial conductance increase or…

Mesoscale and Nanoscale Physics · Physics 2017-05-10 Carlos A. Polanco , Rouzbeh Rastgarkafshgarkolaei , Jingjie Zhang , Nam Le , Pamela M. Norris , Avik W. Ghosh

Polymer composite performance depends significantly on the polymer matrix, additives, processing conditions, and measurement setups. Traditional physics-based optimization methods for these parameters can be slow, labor-intensive, and…

In this paper we study the thermal effective behaviour for 3D multiphase composite material consisting of three isotropic phases which are the matrix, the inclusions and the coating media. For this purpose we use an accelerated FFT-based…

Computational Engineering, Finance, and Science · Computer Science 2015-04-29 Sophie Lemaitre , Vladimir Salnikov , Daniel Choi , Philippe Karamian

Homogenization of a simultaneous heat and moisture flow in a masonry wall is presented in this paper. The principle objective is to examine an impact of the assumed imperfect hydraulic contact on the resulting homogenized properties. Such a…

Computational Engineering, Finance, and Science · Computer Science 2014-02-14 Jan Sýkora , Michal Šejnoha , Jiří Šejnoha

This paper deals with the empirical validation of a building thermal model using a phase change material (PCM) in a complex roof. A mathematical model dedicated to phase change materials based on the heat apparent capacity method was…

The thermo-electrical properties of a complex silicon cantilever structure used in thermal scanning probe lithography are modeled based on well established empirical laws for the thermal conductivity in silicon, the electrical conductivity…

Materials Science · Physics 2017-11-28 M. Spieser , C. Rawlings , E. Lörtscher , U. Duerig , A. W. Knoll

We review the current state of the art of graphene-enhanced thermal interface materials for the management of heat the next generation of electronics. Increased integration densities, speed, and power of electronic and optoelectronic…

Applied Physics · Physics 2020-08-26 Jacob S. Lewis , Timothy Perrier , Zahra Barani , Fariborz Kargar , Alexander A. Balandin

The paper deals with an empirical validation of a building thermal model. We put the emphasis on sensitivity analysis and on research of inputs/residual correlation to improve our model. In this article, we apply a sensitivity analysis…

Data Analysis, Statistics and Probability · Physics 2012-12-24 Thierry Alex Mara , Harry Boyer , François Garde

Fire protection mainly takes place through physical or chemical pathways or both of them. The thermal diffusivity is one of the basic thermophysical properties which can connect the chemical structure. It is well-known in the literature…

Computational Physics · Physics 2017-10-05 Maryam Mohammadi , Jamal Davoodi

Materials with strong electronic Coulomb correlations play an increasing role in modern materials applications. "Thermochromic" systems, which exhibit thermally induced changes in their optical response, provide a particularly interesting…

Strongly Correlated Electrons · Physics 2009-08-26 Jan M. Tomczak , Silke Biermann

In this paper an asymptotic homogenization method for the analysis of composite materials with periodic microstructure in presence of thermodiffusion is described. Appropriate down-scaling relations correlating the microscopic fields to the…

Mathematical Physics · Physics 2015-12-31 A. Bacigalupo , L. Morini , A. Piccolroaz

We present an experimental demonstration of passive, dynamic thermal regulation in a solid-state system with temperature-dependent thermal emissivity switching. We achieve this effect using a multilayered device, comprised of a vanadium…

The lithium metal-solid-state electrolyte interface plays a critical role in the performance of solid-state batteries. However, operando characterization of the buried interface morphology in solid-state cells is particularly difficult…

Computerized integrity test of an electronic product hardware interface and product probing validation are considered. Integrity testing is based on a current voltage characteristic measurement, when a small voltage and/or current stimuli…

Other Computer Science · Computer Science 2015-03-12 A. M. Dorman

At the ultra-thin limit below 20 nm, a film's electrical conductivity, thermal conductivity, or thermoelectricity depends heavily on its thickness. In most studies, each sample is fabricated one at a time, potentially leading to…

Mesoscale and Nanoscale Physics · Physics 2023-06-22 Kien Trung Nguyen , Giang Bui-Thanh , Hong Thi Pham , Thuat Nguyen-Tran , Chi Hieu Hoang , Hung Q. Nguyen

Spatial mapping of thermal properties is critical for unveiling the structure-property relation of materials, heterogeneous interfaces, and devices. These property images can also serve as datasets for training artificial intelligence…

Applied Physics · Physics 2025-07-18 Haobo Yang , Zhenguo Zhu , Zhongnan Xie , Jinhong Du , Shuo Bai , Hong Guo , Te-Huan Liu , Ronggui Yang , Xin Qian

We present an experimental setup and methodology designed to facilitate high-precision thermal measurements required for infrared medical tomography. The approach which is best suited for the study of specialized hardware phantoms comprises…

Medical Physics · Physics 2026-04-08 Anna Frixou , Efstathios Stiliaris , Costas N. Papanicolas

An uncoupled multi-scale homogenization approach is used to estimate the effective thermal conductivities of plain weave C/C composites with a high degree of porosity. The geometrical complexity of the material system on individual scales…

Materials Science · Physics 2008-07-23 Blanka Tomkova , Michal Sejnoha , Jan Novak , Jan Zeman

Measuring temperature fields in semi-transparent media requires the knowledge of material thermo-optic properties. While the current techniques are well established for isothermal thin films, they remain unexplored for thick media where…

Applied Physics · Physics 2025-05-02 Jordan Letessier , Abel Netter , Jérémie Maire , Stéphane Chevalier

The thermal characteristics of silicon between 15 and 300 deg K are investigated by applying a computer program on the solution of the differential heat diffusion equation. The computer model is linked to high-purity silicon through a set…

Materials Science · Physics 2007-08-31 H. Diedrich , R. Liberati