We investigate the structural damage of graphene underlying dielectrics (HfO2 and Al2O3) by remote plasma-enhanced atomic layer deposition (PE-ALD). Dielectric film is grown on bilayer graphene without inducing significant damage to the bottom graphene layer. Based on Raman spectra, we demonstrate that the bottom graphene layer has the salient features of single layer graphene. During the initial half-cycle PE-ALD, the upper graphene layer reacts with the metal precursor, forming uniform nucleation islands or an active metallic carbide layer. After monolayer dielectric coverage, the bottom graphene layer has additional protection. The upper graphene layer serves as a sacrificial layer, which not only promotes the adhesion of dielectric on graphene, but also protects the lattice symmetry of the bottom graphene layer. Our results indicate that bilayer graphene allows for controlling/limiting the degree of defect during the ALD of dielectrics and could be a good starting material for building filed effect transistors and sensing devices.
@article{arxiv.1403.3787,
title = {Using top graphene layer as sacrificial protection during dielectric atomic layer deposition},
author = {Xiaohui Tang and Nicolas Reckinger and Olivier Poncelet and Pierre Louette and Jean-François Colomer and Jean-Pierre Raskin and Benoit Hackens and Laurent A. Francis},
journal= {arXiv preprint arXiv:1403.3787},
year = {2014}
}