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Thermal activation of low-density Ga implanted in Ge

Materials Science 2022-06-01 v1

Abstract

The nuclear spins of low-density implanted Ga atoms in Ge are interesting candidates for solid state-based qubits. To date, activation studies of implanted Ga in Ge have focused on high densities. Here we extend activation studies into the low-density regime. We use spreading resistance profiling and secondary ion mass spectrometry to derive electrical activation of Ga ions implanted into Ge as a function of rapid thermal anneal temperature and implant density. We show that for our implant conditions the activation is best for anneal temperatures between 400 and 650 ^\circC, with a maximum activation of 64% at the highest fluence. Below 400 ^\circC, remaining implant damage results in defects that act as superfluous carriers, and above 650 ^\circC, surface roughening and loss of Ga ions are observed. The activation increased monotonically from 10% to 64% as the implant fluence increased from 6×10106\times10^{10} to 6×10126\times10^{12} cm2^{-2}. The results provide thermal anneal conditions to be used for initial studies of using low-density Ga atoms in Ge as nuclear spin qubits.

Keywords

Cite

@article{arxiv.2204.02878,
  title  = {Thermal activation of low-density Ga implanted in Ge},
  author = {Natalie D. Foster and Andrew J. Miller and Troy A. Hutchins-Delgado and Christopher M. Smyth and Michael C. Wanke and Tzu-Ming Lu and Dwight R. Luhman},
  journal= {arXiv preprint arXiv:2204.02878},
  year   = {2022}
}

Comments

7 pages, 4 figures