Materials Science · Physics
A Novel Strategy to Strengthen Directionally Solidified Superalloy Through Grain Boundary Simplified Design
Yunpeng Fan, Xinbao Zhao, Yu Zhou, Quanzhao Yue +3
2025-11-20
Materials Science · Physics
Per-grain and neighbourhood stress interactions during deformation of a ferritic steel obtained using three-dimensional X-ray diffraction
James A. D. Ball, Anna Kareer, Oxana V. Magdysyuk, Stefan Michalik +2
2024-03-20
Materials Science · Physics
Microstructure-dependent local strain behavior in polycrystals through in situ scanning electron microscope tensile experiments
M. A. Tschopp, B. B. Bartha, W. J. Porter, P. T. Murray +1
2013-09-02
Superconductivity · Physics
Core pinning by intragranular nanoprecipitates in polycrystalline MgCNi_3
L. D. Cooley, X. Song, J. Jiang, D. C. Larbalestier +3
2009-11-07
Materials Science · Physics
Pronounced grain boundary network evolution in nanocrystalline Cu subjected to large cyclic strains
David B. Bober, Thomas LaGrange, Mukul Kumar, Timothy J. Rupert
2019-02-20
Applied Physics · Physics
Columnar grain boundaries are the weakest link in hard coatings: Insights from micro-cantilever testing with bridge notches
Yinxia Zhang, Matthias Bartosik, Steffen Brinckmann, Ujjval Bansal +2
2024-11-20
Mesoscale and Nanoscale Physics · Physics
Tuning carbon nanotube bandgaps with strain
E. D. Minot, Yuval Yaish, Vera Sazonova, Ji-Yong Park +2
2009-11-07
Materials Science · Physics
Nanoscale Investigation of Microcracks and Grain Boundary Wetting in Press Hardened Galvanized 20MnB8 Steel
M. Arndt, P. Kürnsteiner, T. Truglas, J. Duchoslav +7
2021-12-30
Materials Science · Physics
Electric field and tip geometry effects on dielectrophoretic growth of carbon nanotube nanofibrils on scanning probes
Haoyan Wei, Anna Craig, Bryan D Huey, Fotios Papadimitrakopoulos +1
2011-06-21
Materials Science · Physics
Modified Z-Phase Formation in a 12% Cr Tempered Martensite Ferritic Steel during Long-Term Creep
Johan Ewald Westraadt, William Edward Goosen, Aleksander Kostka, Hongcai Wang +1
2022-07-01
Materials Science · Physics
Microstructure and high temperature mechanical properties of liquid-phase-sintered $\alpha$-SiC with Y$_2$O$_3$-Al$_2$O$_3$ additions
Miguel Castillo Rodríguez, Antonio Muñoz Bernabé, Arturo Domínguez Rodríguez
2024-02-15
Materials Science · Physics
A Novel Analysis Framework for Microstructural Characterization of Ferroelectric Hafnia: Experimental Validation and Application
Yoonsang Park, Jaeduck Jang, Hyangsook Lee, Kihong Kim +10
2025-06-25
Materials Science · Physics
Evaluation of local stress state due to grain-boundary sliding during creep within a crystal plasticity finite element multi-scale framework
Markian Petkov, Elsiddig Elmukashfi, Edmund Tarleton, Alan C. F. Cocks
2021-03-02
Applied Physics · Physics
Grain refinement in unalloyed tantalum structure deposited using Wire + Arc Additive Manufacture and vertical cold rolling
G. Marinelli, F. Martina, S. Ganguly, S. Williams
2019-03-27
Materials Science · Physics
Modelling the relationship between deformed microstructures and static recrystallization textures: application to ferritic stainless steels
Arthur Després, Jean-Denis Mithieux, Chad. W. Sinclair
2021-02-22
Superconductivity · Physics
Critical current densities and microstructures in Rod-in-Tube and Tube Type Nb3Sn strands - Present status and prospects for improvement
X Xu, M D Sumption, S Bhartiya, X Peng +1
2015-06-15
Applied Physics · Physics
A novel method of experimental determination of grain stresses and critical resolved shear stresses for slip and twin systems in a magnesium alloy
P. Kot, M. Wroński, A. Baczmański, A. Ludwik +5
2023-08-24
General Mathematics · Mathematics
Computational modeling of crack-tip fields in transversely isotropic strain-limiting solids subjected to piecewise linear slope loads
S. M. Mallikarjunaiah, Saugata Ghosh, Dambaru Bhatta
2026-04-30
Materials Science · Physics
Suppressing Kirkendall Void Density in Circuit Interconnections by Strain Annealing
Chongyang Cai, Rong An, Chunqing Wang, Yanhong Tian
2017-12-20
Materials Science · Physics
In-situ study of creep in Sn-3Ag-0.5Cu solder
Tianhong Gu, Vivian Tong, Christopher M. Gourlay, T. Ben Britton
2020-06-11