English

Pressure induced metallization of Cu3N

Materials Science 2009-11-11 v1

Abstract

We employed accurate full potential density-functional theory and linearized augmented plane wave method to investigate the electronic properties and possible phase transitions of Cu3N under high pressure. The anti perovskite structure Cu3N is a semiconductor with a small indirect band gap at ambient pressure. The band gap becomes narrower with increasing pressure, and the semi-conducting anti ReO3 structure undergoes a semiconductor to semimetal transition at pressure around 8.0 GPa. At higher pressure, a subsequent semimetal to metal transition could take place above 15GPa with a structural transition from anti ReO3 to Cu3Au structure.

Keywords

Cite

@article{arxiv.cond-mat/0504421,
  title  = {Pressure induced metallization of Cu3N},
  author = {Wen Yu and Linyan Li and Changqing Jin},
  journal= {arXiv preprint arXiv:cond-mat/0504421},
  year   = {2009}
}