We describe two general procedures for fabricating microstructures with large overhangs and high aspect-ratio support pillars. The first method uses a static angled dry etch on micro- or nano-pillars to create an initial overhang, followed by wet etching for further erosion. The second method uses a time-dependent angled etch on a flat plane patterned with protective resin, to reduce the number of lithography steps needed to make these objects. The time-dependent dry etch is again followed by a wet etch. For the second method we derive a formula that provides the rate at which the attack angle must evolve, given a known etch rate within the target material, the depth of the desired overhang (undercut), and the instantaneous attack angle.
Cite
@article{arxiv.2011.09777,
title = {Making large overhangs in micrometer and nanometer-sized structures},
author = {Noah Van Horne and Manas Mukherjee},
journal= {arXiv preprint arXiv:2011.09777},
year = {2020}
}