Development of Readout Interconnections for the Si-W Calorimeter of SiD
Instrumentation and Detectors
2015-06-03 v2 High Energy Physics - Experiment
Abstract
The SiD collaboration is developing a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including oxidation removal processes, pad surface preparation, solder ball selection and placement, and bond quality assurance. Our results show that solder ball bonding is a promising technique for the Si-W ECAL, and unresolved issues are being addressed.
Keywords
Cite
@article{arxiv.1110.6924,
title = {Development of Readout Interconnections for the Si-W Calorimeter of SiD},
author = {M. Woods and R. G. Fields and B. Holbrook and R. L. Lander and A. Moskaleva and C. Neher and J. Pasner and M. Tripathi and J. E. Brau and R. E. Frey and D. Strom and M. Breidenbach and D. Freytag and G. Haller and R. Herbst and T. Nelson and S. Schier and B. Schumm},
journal= {arXiv preprint arXiv:1110.6924},
year = {2015}
}
Comments
8 pages + title, 6 figures