We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are here discussed.
@article{arxiv.0910.3629,
title = {Development of 3D-DDTC pixel detectors for the ATLAS upgrade},
author = {G. -F. Dalla Betta and M. Boscardin and G. Darbo and C. Gemme and A. La Rosa and H. Pernegger and C. Piemonte and M. Povoli and S. Ronchin and A. Zoboli and N. Zorzi},
journal= {arXiv preprint arXiv:0910.3629},
year = {2011}
}
Comments
20 pages, 14 figures, presented at 7th International "Hiroshima" Symposium on Development and Applications of Semiconductor Tracking Devices International Conference Center Hiroshima, Japan, Aug. 29-Sep.1, 2009