Crystal structure informed mesoscale deformation model for HCP Cu6Sn5 intermetallic compound
Materials Science
2023-05-31 v2 Mesoscale and Nanoscale Physics
Abstract
In the electronic packaging and energy storage sectors, the study of Cu6Sn5 intermetallic compound (IMC) is getting more attention. At temperatures above 186 oC, this IMC exists in a hexagonal closed packed (HCP) crystalline structure. Crystal plasticity finite element simulations are performed on Cu6Sn5 IMC by taking the information about its lattice parameters and direction dependent elastic properties. Three types of models corresponding to deformations in basal, prismatic and pyramidal modes are developed. With the same type of loading in the elastic regime and boundary conditions, the results of the computations reveal the differences in displacement magnitudes among the three model types.
Cite
@article{arxiv.2305.10582,
title = {Crystal structure informed mesoscale deformation model for HCP Cu6Sn5 intermetallic compound},
author = {Anil Kunwar and Haoran Ma and Johan Hektor},
journal= {arXiv preprint arXiv:2305.10582},
year = {2023}
}