Copper Replaces Tin: A Copper based Gelling Catalyst for Poly-Urethane from Discarded Motherboard

Bibudha Parasar; Gao Wen Jing; Dandan Yuan; Wang Kun; Peng Wang; Arijit Dasgupta; Atharva Sahasrabudhe; Soumitra Barman; Rongxin Yuan; Soumyajit Roy

Copper Replaces Tin: A Copper based Gelling Catalyst for Poly-Urethane from Discarded Motherboard

Materials Science 2013-07-11 v1

Authors: Bibudha Parasar , Gao Wen Jing , Dandan Yuan , Wang Kun , Peng Wang , Arijit Dasgupta , Atharva Sahasrabudhe , Soumitra Barman , Rongxin Yuan , Soumyajit Roy

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Abstract

A discarded motherboard based eco-friendly copper catalyst has been programmed to replace the industrially used tin based catalyst DBTDL. The catalyst has been characterized by UV-Vis spectroscopy, FT-IR and TEM. Using the catalyst reaction conditions is optimized and under the optimized condition, both polyurethane and polyurethane foam are prepared, thus proving the generality of the catalyst to be used in industries. A possible mechanism has also been proposed.

Keywords

copper catalyst polyurethane discarded motherboard tin replacement dbtdl gelling catalyst recycling

Cite

@article{arxiv.1307.2671,
  title  = {Copper Replaces Tin: A Copper based Gelling Catalyst for Poly-Urethane from Discarded Motherboard},
  author = {Bibudha Parasar and Gao Wen Jing and Dandan Yuan and Wang Kun and Peng Wang and Arijit Dasgupta and Atharva Sahasrabudhe and Soumitra Barman and Rongxin Yuan and Soumyajit Roy},
  journal= {arXiv preprint arXiv:1307.2671},
  year   = {2013}
}

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24 pages, 10 figures

Copper Replaces Tin: A Copper based Gelling Catalyst for Poly-Urethane from Discarded Motherboard

Abstract

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