There is increased interest in the heterogeneous integration of various compound semiconductors with Si for a variety of electronic and photonic applications. This paper focuses on integrating GaAsSb (with absorption in the C-band at 1550nm) with silicon to fabricate photodiodes, leveraging epitaxial layer transfer (ELT) methods. Two ELT techniques, epitaxial lift-off (ELO) and macro-transfer printing (MTP), are compared for transferring GaAsSb films from InP substrates to Si, forming PIN diodes. Characterization through atomic force microscopy (AFM), and transmission electron microscopy (TEM) exhibits a high-quality, defect-free interface. Current-voltage (IV) measurements and capacitance-voltage (CV) analysis validate the quality and functionality of the heterostructures. Photocurrent measurements at room temperature and 200 K demonstrate the device's photo-response at 1550 nm, highlighting the presence of an active interface.
@article{arxiv.2407.17607,
title = {Active Interface Characteristics of Heterogeneously Integrated GaAsSb/Si Photodiodes},
author = {Manisha Muduli and Yongkang Xia and Seunghyun Lee and Nathan Gajowski and Chris Chae and Siddharth Rajan and Jinwoo Hwang and Shamsul Arafin and Sanjay Krishna},
journal= {arXiv preprint arXiv:2407.17607},
year = {2024}
}
Comments
14 pages, 5 figures, Pages 15-16 supplementary information