The rapid growth of wireless communications has created a significant demand for high throughput, seamless connectivity, and extremely low latency. To meet these goals, a novel technology -- stacked intelligent metasurfaces (SIMs) -- has been developed to perform signal processing by directly utilizing electromagnetic waves, thus achieving incredibly fast computing speed while reducing hardware requirements. In this article, we provide an overview of SIM technology, including its underlying hardware, benefits, and exciting applications in wireless communications. Specifically, we examine the utilization of SIMs in realizing transmit beamforming and semantic encoding in the wave domain. Additionally, channel estimation in SIM-aided communication systems is discussed. Finally, we highlight potential research opportunities and identify key challenges for deploying SIMs in wireless networks to motivate future research.
@article{arxiv.2407.03566,
title = {Stacked Intelligent Metasurfaces for Wireless Communications: Applications and Challenges},
author = {Hao Liu and Jiancheng An and Xing Jia and Lu Gan and George K. Karagiannidis and Bruno Clerckx and Mehdi Bennis and Mérouane Debbah and Tie Jun Cui},
journal= {arXiv preprint arXiv:2407.03566},
year = {2025}
}