Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications
Optics
2024-12-10 v1 Materials Science
Abstract
We report on the successful design and fabrication of optical modules using a 50 micron pitch polymer waveguide interface, integrated for low loss, high density optical data transfer with very low space requirements on a Si photonics die. This prototype module meets JEDEC reliability standards and promises to increase the number of optical fibers that can be connected at the edge of a chip, a measure known as beachfront density, by six times compared to state of the art technology. Scalability of the polymer waveguide to less than 20 micron pitch stands to improve the bandwidth density upwards of 10 Tbps/mm.
Cite
@article{arxiv.2412.06570,
title = {Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications},
author = {John Knickerbocker and Jean Benoit Heroux and Griselda Bonilla and Hsiang Hsu and Neng Liu and Adrian Paz Ramos and Francois Arguin and Yan Tribodeau and Badr Terjani and Mark Schultz and Raghu Kiran Ganti and Linsong Chu and Chinami Marushima and Yoichi Taira and Sayuri Kohara and Akihiro Horibe and Hiroyuki Mori and Hidetoshi Numata},
journal= {arXiv preprint arXiv:2412.06570},
year = {2024}
}