Electronic Transport through YBCO Grain Boundary Interfaces between 4.2 K and 300 K

C. W. Schneider; S. Hembacher; G. Hammerl; R. Held; A. Schmehl; A. Weber; T. Kopp; J. Mannhart

doi:10.1103/PhysRevLett.92.257003

Electronic Transport through YBCO Grain Boundary Interfaces between 4.2 K and 300 K

Superconductivity 2010-05-24 v2 Strongly Correlated Electrons

Authors: C. W. Schneider , S. Hembacher , G. Hammerl , R. Held , A. Schmehl , A. Weber , T. Kopp , J. Mannhart

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Abstract

The current-induced dissipation in YBCO grain boundary tunnel junctions has been measured between 4.2 K and 300 K. It is found that the resistance of 45 degree (100)/(110) junctions decreases linearly by a factor of four when their temperature is increased from 100 K to 300 K. At the superconducting transition temperature Tc the grain boundary resistance of the normal state and of the superconducting state extrapolate to the same value.

Keywords

thermal properties of materials

Cite

@article{arxiv.cond-mat/0307470,
  title  = {Electronic Transport through YBCO Grain Boundary Interfaces between 4.2 K and 300 K},
  author = {C. W. Schneider and S. Hembacher and G. Hammerl and R. Held and A. Schmehl and A. Weber and T. Kopp and J. Mannhart},
  journal= {arXiv preprint arXiv:cond-mat/0307470},
  year   = {2010}
}

Comments

14 pages, 4 figures

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