The Network-on-chip (NoC) designs consisting of large pack of Intellectual Property (IP) blocks (cores) on the same silicon die is becoming technically possible nowadays. But, the communication between the IP Cores is the main issue in recent years. This paper presents the design of a Code Division Multiple Access (CDMA) based wrapper interconnect as a component of System on programmable chip (SOPC) builder to communicate between IP cores. In the proposal, only bus lines that carry address and data signals are CDMA coded. CDMA technology has better data integrity, channel continuity, channel isolation, and also mainly it reduces the no.of lines in the bus architecture for transmitting the data from master to slave.
@article{arxiv.1205.4487,
title = {CDMA Based Interconnect Mechanism for SOPC},
author = {V. Rajesh and P. Vijaya Kumar},
journal= {arXiv preprint arXiv:1205.4487},
year = {2012}
}