Additional Boundary Condition for a Wire Medium Connected to a Metallic Surface
Abstract
In this work, we demonstrate that the interaction of electromagnetic waves with a microstructured material formed by metallic wires connected to a metallic surface can be described using homogenization methods provided an additional boundary condition is considered. The additional boundary condition is derived by taking into account the specific microstructure of the wire medium. To illustrate the application of the result, we characterize a substrate formed by an array of tilted metallic wires connected to a ground plane, demonstrating that in such configuration the wire medium behaves essentially as a material with extreme optical anisotropy and that in some circumstances the substrate can be seen as an impedance surface.
Cite
@article{arxiv.0711.4515,
title = {Additional Boundary Condition for a Wire Medium Connected to a Metallic Surface},
author = {Mario G. Silveirinha and Carlos A. Fernandes and Jorge R. Costa},
journal= {arXiv preprint arXiv:0711.4515},
year = {2009}
}
Comments
26 pages; under review