The next generation of experiments for rare-event searches based on skipper Charge Coupled Devices (skipper-CCDs) presents new challenges for the sensor packaging and readout. Scaling the active mass and simultaneously reducing the experimental backgrounds in orders of magnitude requires a novel high-density silicon-based package that must be massively produced and tested. In this work, we present the design, fabrication, testing, and empirical signal model of a multi-channel silicon package. In addition, we outline the chosen specifications for the ongoing production of 1500 wafers that will add up to a 10 kg skipper-CCD array with 24000 readout channels.
@article{arxiv.2410.06417,
title = {A multi-channel silicon package for large-scale skipper-CCD experiments},
author = {A. M. Botti and C. Chavez and M. Sofo-Haro and C. S. Miller and F. Chierchie and M. Jonas and M. Lisovenko and H. Gutti and D. Czaplewski and A. Lathrop and J. Tiffenberg and G. Fernandez-Moroni and J. Estrada},
journal= {arXiv preprint arXiv:2410.06417},
year = {2025}
}