3D-Printed Optics for Wafer-Scale Probing
Applied Physics
2018-09-03 v1
Abstract
Mass production of photonic integrated circuits requires high-throughput wafer-level testing. We demonstrate that optical probes equipped with 3D-printed elements allow for efficient coupling of light to etched facets of nanophotonic waveguides. The technique is widely applicable to different integration platforms.
Cite
@article{arxiv.1808.10834,
title = {3D-Printed Optics for Wafer-Scale Probing},
author = {Mareike Trappen and Matthias Blaicher and Philipp-Immanuel Dietrich and Tobias Hoose and Yilin Xu and Muhammad Rodlin Billah and Wolfgang Freude and Christian Koos},
journal= {arXiv preprint arXiv:1808.10834},
year = {2018}
}
Comments
Accepted for presentation at European Conference on Optical Communications (ECOC) 2018