Related papers: Pixel Detectors for Tracking and their Spin-off in…
Pixel detectors are used in the innermost part of multi purpose experiments at the Large Hadron Collider (LHC) and are therefore exposed to the highest fluences of ionising radiation, which in this part of the detectors consists mainly of…
We developed a novel design of a Micro Pixel Chamber ($\mu$-PIC) with resistive electrodes for a charged-particle-tracking detector in high-rate applications. Diamond-Like Carbon (DLC) thin film is used for the cathodes. The resistivity can…
Thin Film technology has widespread applications in everyday electronics, notably Liquid Crystal Display screens, solar cells, and organic light emitting diodes. We explore the potential of this technology as charged particle radiation…
To cope with the High Luminosity LHC harsh conditions, the ATLAS inner tracker has to be upgraded to meet requirements in terms of radiation hardness, pile up and geometrical acceptance. The active edge technology allows to reduce the…
This paper covers the main technological and design aspects relevant to the development of a new generation of thin 3D pixel sensors with small pixel size aimed at the High-Luminosity LHC upgrades.
At least 25 kinds of detector-like devices need to be integrated in Phase I of the High Energy Photon Source (HEPS), and the work needs to be carefully planned to maximise productivity with highly limited human resources. After a systematic…
Monolithic CMOS sensors in a 65 nm imaging technology are being investigated by the CERN EP Strategic R&D Programme on Technologies for Future Experiments for an application in particle physics. The appeal of monolithic detectors lies in…
The Upgrade II of the LHCb detector, foreseen for 2031, will operate at an instantaneous luminosity of 1.5 x 10$^{34}$ cm$^{-2}$s$^{-1}$, accumulating a sample of more than 300 fb$^{-1}$. To cope with the estimated pile-up of 42 and 200…
Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk…
The depleted CMOS sensors are emerging as one of the main candidate technologies for future tracking detectors in high luminosity colliders. Its capability of integrating the sensing diode into the CMOS wafer hosting the front-end…
We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $\mu$m thick, produced at VTT…
The CMS inner pixel detector system is planned to be replaced during the first phase of the LHC luminosity upgrade. The plans foresee an ultra low mass system with four barrel layers and three disks on either end. With the expected increase…
X-ray hybrid CMOS detectors (HCDs) are a promising candidate for future x-ray missions requiring high throughput and fine angular resolution along with large field-of-view, such as the high-definition x-ray imager (HDXI) instrument on the…
This paper reviews the development of CMOS Monolithic Active Pixel Sensors (MAPS) for future vertex detectors. MAPS are developed in a standard CMOS technology. In the imaging field, where the technology found its first applications, they…
The ATLAS inner detector comprises three different sub-detectors: the pixel detector, the silicon strip tracker, and the transition-radiation drift-tube tracker. The Insertable $B$-Layer, a new innermost pixel layer, was installed during…
A hybrid photo-detector (HPD) consisting of a photocathode and a multi-pixel avalanche diode (MP-AD) was developed a few years ago. Our previous studies showed that its inherent potential for high resolution photon counting could be further…
Monolithic Active Pixel Sensors (MAPS) combine the sensing part and the front-end electronics in the same silicon layer, making use of CMOS technology. Profiting from the progresses of this commercial process, MAPS have been undergoing…
The ATLAS pixel detector consists of 1744 identical silicon pixel modules arranged in three barrel layers providing coverage for the central region, and three disk layers on either side of the primary interaction point providing coverage of…
In the first LHC running period the CMS-pixel detector had to face various operational challenges and had to adapt to the rapidly changing beam conditions. In order to maximize the physics potential and the quality of the data, online and…
The vertex detectors are crucial detectors for future linear e+e- colliders since they must give the most accurate location of any outgoing charged particles originating from the interaction point. The DEPFET collaboration is developing a…