Related papers: Front-End electronics and integration of ATLAS pix…

The CMS pixel detector consists of approximately 66 million silicon pixels whose analog signals are read out by 15,840 programmable Readout Chips. With the recent startup of the LHC, the detector is now collecting data used for precise…

The on-detector optical link of the ATLAS pixel detector contains radiation-hard receiver chips to decode bi-phase marked signals received on PIN arrays and data transmitter chips to drive VCSEL arrays. The components are mounted on hybrid…

The High Luminosity Large Hadron Collider (HL-LHC) at CERN is expected to collide protons at a center-of-mass energy of 14 TeV and to reach the unprecedented peak instantaneous luminosity of $7.5 \times 10^{34} \text{cm}^{-2} \text{s}^{-1}$…

Silicon pixel detectors are at the core of the current ATLAS detector and its planned upgrade. As the detectors in closest proximity to the interaction point, they will be exposed to a significant amount of radiation: prior to the HL-LHC,…

In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. Because of its radiation hardness and cost effectiveness, the n-on-p silicon…

A novel gaseous two-dimensional imaging detector "Micro Pixel Chamber (micro-PIC)" has been developed. This detector is based on double sided printed circuit board (PCB). We have developed large area (10cm x 10cm) micro-PICs with 65536…

In the framework of the HL-LHC upgrade, the ATLAS experiment plans to introduce an all-silicon inner tracker to cope with the elevated occupancy. To investigate the suitability of pixel sensors using the proven planar technology for the…

Many of the interesting physics processes to be measured at the LHC have a signature involving one or more isolated electrons. The electron reconstruction and identification efficiencies of the ATLAS detector at the LHC have been evaluated…

We present the results of the characterization of novel n-in-p planar pixel detectors, designed for the future upgrades of the ATLAS pixel system. N-in-p silicon devices are a promising candidate to replace the n-in-n sensors thanks to…

The ATLAS detector is capable of resolving the highest energy pp collisions at luminosities sufficient to yield 10's of simultaneous interactions within a bunch collision lasting <0.5 nsec. Already in 2011 a mean occupancy of 20 is often…

Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 $\mu$m, produced at CiS, and 100-200 $\mu$m thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and…

We report on a large active area (15x15mm2), high channel density (470 pixels/mm2), self-triggering CMOS analog chip that we have developed as pixelized charge collecting electrode of a Micropattern Gas Detector. This device, which…

The MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker requirements for the HL-LHC. Several 4-chip…

An upgrade of the ATLAS experiment for the High Luminosity phase of LHC is planned for 2024 and foresees the replacement of the present Inner Detector (ID) with a new Inner Tracker (ITk) completely made of silicon devices. Depleted active…

Integration is currently the only feasible route towards scalable photonic quantum processing devices that are sufficiently complex to be genuinely useful in computing, metrology, and simulation. Embedded on-chip detection will be critical…

The M\"ONCH hybrid pixel detector, with a 25 \textmu m pixel pitch and fast charge-integrating readout, has demonstrated subpixel resolution capabilities for X-ray imaging and deep learning-based electron localization in electron…

The RICH detectors of the LHCb experiment provide identification of hadrons produced in high energy proton-proton collisions in the LHC at CERN over a wide momentum range (2 to 100 GeV/c). Cherenkov light is collected on photon detector…

Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D phase, and in general for small-scale applications, such…

The ATLAS experiment has successfully recorded over 300 nb^-1 of pp collisions at 7 TeV provided by the Large Hadron Collider, with an efficiency of 94%. We describe the data acquisition, trigger, reconstruction, calibration, monitoring,…

The capacitance of the charge collection node of a sensor system is an important parameter for the design of the analog front-end electronics. The analog front-end of high-granularity sensors like for example hybrid pixel detectors need to…