Related papers: Cooling Channel Design Optimization for High Power…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
As GPU architectures rapidly evolve to meet the growing demands of exascale computing and machine learning, the performance implications of architectural innovations remain poorly understood across diverse workloads. NVIDIA Blackwell (B200)…
District energy systems can not only reduce energy consumption but also set energy supply dispatching schemes according to demand. In this paper, the combined cooling heating and power economic emission dispatch (CCHPEED) model is…
In analog neuromorphic chips, designers can embed computing primitives in the intrinsic physical properties of devices and circuits, heavily reducing device count and energy consumption, and enabling high parallelism, because all devices…
We study scheduling problems motivated by recently developed techniques for microprocessor thermal management at the operating systems level. The general scenario can be described as follows. The microprocessor's temperature is controlled…
Heat-Bath Algorithmic Cooling is a set of techniques for producing highly pure quantum systems by utilizing a surrounding heat-bath and unitary interactions. These techniques originally used the thermal environment only to fully thermalize…
Leveraging electrochemical and thermal energy storage systems has been proposed as a strategy to reduce peak power in data centers. Thermal energy storage systems, such as chilled water tanks, have gained increasing attention in data…
In this paper, we show that it is possible to significantly boost the heat extraction ability of the ICO fridge by applying N identical thermalising channels in a superposition of N cyclic causal orders[2], and that this can be further…
With the increasing power density of electronics components, the heat dissipation capacity of heat sinks gradually becomes a bottleneck. Many structural optimization methods, including topology optimization, have been widely used for heat…
Refrigerators use a thermodynamic cycle to move thermal energy from a cold reservoir to a hot one. Implementing this operation principle with mesoscopic components has recently emerged as a promising strategy to control heat currents in…
Multi-Processor Systems-on-Chip (MPSoC) can deliver high performance needed in many industrial domains, including aerospace. However, their high power consumption, combined with avionics safety standards, brings new thermal management…
In this paper, we study a problem of controlling cooling facilities and computational equipments for energy-efficient operations of data centers. Although a plethora of approaches have been proposed in previous literatures, there is a lack…
Cutting edge FPGAs are not energy efficient as conventionally presumed to be, and therefore, aggressive power-saving techniques have become imperative. The clock rate of an FPGA-mapped design is set based on worst-case conditions to ensure…
Modern multi-core systems have a large number of design parameters, most of which are discrete-valued, and this number is likely to keep increasing as chip complexity rises. Further, the accurate evaluation of a potential design choice is…
The thermal conductivity of Functionally Graded Materials (FGMs) can be efficiently designed through topology optimization to obtain thermal meta-structures that actively steer the heat flow. Compared to conventional analytical design…
The AI datacenters are currently being deployed on a large scale to support the training and deployment of power-intensive large-language models (LLMs). Extensive amount of computation and cooling required in datacenters increase concerns…
We analyze the theoretical framework of a shape optimization problem for a microchannel cooling system. To this end, a cost functional based on the tracking of absorbed energy by the cooler as well as some desired flow on a subdomain of the…
With the current high levels of energy consumption of data centers, reducing power consumption by even a small percentage is beneficial. We propose a framework for thermal-aware workload distribution in a data center to reduce cooling power…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
In this research, we developed a graph-based framework to represent various aspects of optimal thermal management system design, with the aim of rapidly and efficiently identifying optimal design candidates. Initially, the graph-based…