Related papers: Generative Design for Direct-to-Chip Liquid Coolin…
We introduce a generative modeling framework for thermodynamic computing, in which structured data is synthesized from noise by the natural time evolution of a physical system governed by Langevin dynamics. While conventional diffusion…
The Animation-based Generative Codec (AGC) is an emerging paradigm for talking-face video compression. However, deploying its intricate decoder on resource and power-constrained edge devices presents challenges due to numerous parameters,…
This manuscript reports a semiconductor-sensitized thermal cell (STC) that converts ambient heat into electrical power while simultaneously reducing its own temperature under isothermal conditions. Using a printable…
As generative technologies advance, visual content has evolved into a complex mix of natural and AI-generated images, driving the need for more efficient coding techniques that prioritize perceptual quality. Traditional codecs and learned…
As an emerging electricity-free cooling technology, radiative cooling employs outer space as the heat sink. With this, a sky-facing thermal emitter is usually required. Due to the black-body radiation limit at ambient temperature, the…
Climate change is amplifying extreme events, posing escalating risks to biodiversity, human health, and food security. GCMs are essential for projecting future climate, yet their coarse resolution and high computational costs constrain…
The massive and large-scale design of foundational semiconductor integrated circuits (ICs) is crucial to sustaining the advancement of many emerging and future technologies, such as generative AI, 5G/6G, and quantum computing. Excitingly,…
The race towards performance increase and computing power has led to chips with heterogeneous and complex designs, integrating an ever-growing number of cores on the same monolithic chip or chiplet silicon die. Higher integration density,…
We study the heat transfer between two nanoparticles held at different temperatures that interact through nonreciprocal forces, by combining molecular dynamics simulations with stochastic thermodynamics. Our simulations reveal that it is…
There is no shortage of energy around to solve the overcooling problem of cooling flow clusters. AGNs, as well as gravitational energy are both energetic enough to balance the cooling of cores of clusters. The challenge is to couple this…
Real-time generative game engines represent a paradigm shift in interactive simulation, promising to replace traditional graphics pipelines with neural world models. However, existing approaches are fundamentally constrained by the ``Memory…
We implement and test the exact time integration method proposed by Townsend 2009 for gas cooling in cosmological hydrodynamic simulations. The errors using this time integrator for the internal energy are limited by the resolution of the…
A solid-state cooling principle based on magnetic-field-driven tunable suppression of Andreev reflection in superconductor/two-dimensional electron gas nanostructures is proposed. This cooling mechanism can lead to very large heat fluxes…
For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…
This paper presents datacenter power profiles, a new NVIDIA software feature released with Blackwell B200, aimed at improving energy efficiency and/or performance. The initial feature provides coarse-grain user control for HPC and AI…
Thermal-aware workload distribution is a common approach in the literature for power consumption optimization in data centers. However, data centers also have other operational costs such as the cost of equipment maintenance and…
The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design space exploration (DSE) to minimize design iterations and unexpected challenges. Emphasizing the pre-register-transfer…
We report on temperature dependent photocurrent measurements of high-quality dual-gated monolayer graphene (MLG) p-n junction devices. A photothermoelectric (PTE) effect governs the photocurrent response in our devices, allowing us to track…
It is known that 3D-ICs suffer from hot spot temperatures that can reach thousands of degrees, if they are not cooled to reasonable operating temperatures. The problem of hot spots is not limited to the high temperatures of the IC; thermal…
Modern multicore processors are employing large last-level caches, for example Intel's E7-8800 processor uses 24MB L3 cache. Further, with each CMOS technology generation, leakage energy has been dramatically increasing and hence, leakage…