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In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
Thermal Desktop (TD) is an industry-standard thermal analysis tool used to create and analyze thermal models for landers, rovers, spacecraft, and instrument payloads. Currently, limited software exists to extract and visualize metrics…
Current cloud computing frameworks host millions of physical servers that utilize cloud computing resources in the form of different virtual machines (VM). Cloud Data Center (CDC) infrastructures require significant amounts of energy to…
Based on deep neural networks (DNNs), deep learning has been successfully applied to many problems, but its mechanism is still not well understood -- especially the reason why over-parametrized DNNs can generalize. A recent statistical…
Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enables more opportunities to architect 3DICs with different die…
Downscaling is essential for generating the high-resolution climate data needed for local planning, but traditional methods remain computationally demanding. Recent years have seen impressive results from AI downscaling models, particularly…
The increasing global emphasis on sustainability and reducing carbon emissions is pushing governments and corporations to rethink their approach to data center design and operation. Given their high energy consumption and exponentially…
Heterogeneous processors with architecturally different cores (CPU and GPU) integrated on the same die lead to new challenges and opportunities for thermal and power management techniques because of shared thermal/power budgets between…
High power density systems require efficient cooling to maintain their thermal performance. Despite this, as systems get larger and more complex, human practice and insight may not suffice to determine the desired thermal management system…
Accurately forecasting the bursty and non-stationary power demand of AI data centers has become increasingly important, as abrupt workload-driven variations at the GPU-node level can affect real-time operational efficiency, power…
3D stacked technology has emerged as an effective mechanism to overcome physical limits and communication delays found in 2D integration. However, 3D technology also presents several drawbacks that prevent its smooth application. Two of the…
iDataCool is an HPC architecture jointly developed by the University of Regensburg and the IBM Research and Development Lab B\"oblingen. It is based on IBM's iDataPlex platform, whose air-cooling solution was replaced by a custom…
The present study introduces a renormalization based approach to investigate the relaxation dynamics within supercooled liquids. By applying a numerical scale transformation to potential energies along the temporal axis, we have established…
The trapped-ion quantum charge-coupled device (QCCD) architecture is a leading candidate for advanced quantum information processing. In current QCCD implementations, imperfect ion transport and anomalous heating can excite ion motion…
Strongly interacting fermions underpin some of the most challenging problems in condensed matter physics, such as high-temperature superconductivity. The low-energy states of these systems encode their essential microscopic properties, yet…
This study presents a geometric deep learning framework for predicting cold spray particle impact responses using finite element simulation data. A parametric dataset was generated through automated Abaqus simulations spanning a systematic…
In recent years, the evolution of artificial intelligence, especially deep learning, has been remarkable, and its application to various fields has been growing rapidly. In this paper, I report the results of the application of generative…
Thermoelectric coolers (TECs) offer a promising solution for direct cooling of local hotspots and active thermal management in advanced electronic systems. However, TECs present significant trade-offs among spatial cooling, heating and…
Accurate simulation of physical processes is crucial for the success of modern particle physics. However, simulating the development and interaction of particle showers with calorimeter detectors is a time consuming process and drives the…
Planogram creation is a significant challenge for retail, requiring an average of 30 hours per complex layout. This paper introduces a cloud-native architecture using diffusion models to automatically generate store-specific planograms.…