Related papers: EMSpice 3: Full-chip Temperature-Aware Multiphysic…
Electromigration (EM) remains a critical reliability concern in current and future copper-based VLSI circuits. As technology scales down, EM-induced IR drop becomes increasingly severe. While several EM-aware IR drop analysis tools have…
In this paper, we briefly introduce physical foundations of electromigration (EM) and present a few classical EMrelated theories. We discuss physical parameters affecting EM wire lifetime and we introduce some background related to the…
Computationally expensive temperature and power grid analyses are required during the design cycle to guide IC design. This paper employs encoder-decoder based generative (EDGe) networks to map these analyses to fast and accurate…
Reliability is a fundamental requirement in any microprocessor to guarantee correct execution over its lifetime. The design rules related to reliability depend on the process technology being used and the expected operating conditions of…
We introduce the energy-stepping Monte Carlo (ESMC) method, a Markov chain Monte Carlo (MCMC) algorithm based on the conventional dynamical interpretation of the proposal stage but employing an energy-stepping integrator. The…
Residual entropy, which reflects the degrees of freedom in a system at absolute zero temperature, is crucial for understanding quantum and classical ground states. Despite its key role in explaining low-temperature phenomena and ground…
Electron transfer (ET) across molecular chains including an impurity is studied based on a recently improved real-time path integral Monte Carlo (PIMC) approach [J. Chem. Phys. {\bf 121}, 12696 (2004)]. The reduced electronic dynamics is…
The uniform electron gas (UEG) at finite temperature is of key relevance for many applications in the warm dense matter regime, e.g. dense plasmas and laser excited solids. Also, the quality of density functional theory calculations…
Monte Carlo simulations using entropic sampling to estimate the number of configurations of a given energy are a valuable alternative to traditional methods. We introduce {\it tomographic} entropic sampling, a scheme which uses multiple…
We develop an all-electron path integral Monte Carlo (PIMC) method with free-particle nodes for warm dense matter and apply it to water and carbon plasmas. We thereby extend PIMC studies beyond hydrogen and helium to elements with core…
Power delivery network (PDN) analysis and thermal analysis are computationally expensive tasks that are essential for successful IC design. Algorithmically, both these analyses have similar computational structure and complexity as they…
The uniform electron gas (UEG) at finite temperature is of high current interest due to its key relevance for many applications including dense plasmas and laser excited solids. In particular, density functional theory heavily relies on…
In a recent publication [S. Groth \textit{et al.}, PRB (2016)], we have shown that the combination of two novel complementary quantum Monte Carlo approaches, namely configuration path integral Monte Carlo (CPIMC) [T. Schoof \textit{et al.},…
We present a novel Exchange Monte Carlo (EMC) method designed for application in continuous-space Path Integral Monte Carlo (PIMC) simulations at finite temperature. Traditional PIMC methods for bosonic systems suffer from long…
This paper presents a novel 3-D full electromagnetic particle-in-cell (PIC) code called JefiPIC, which uses Jefimenko's equations as the electromagnetic (EM) field solver through a full-space integration method. Leveraging the power of…
Electron transpiration cooling (ETC) can reduce aerothermal loads on sharp hypersonic leading edges, but its performance is governed by whether thermionically emitted electrons escape the hot surface or return as cathode-directed backflow.…
By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…
This paper addresses the challenges of thermal sensor allocation and full-chip temperature reconstruction in multi-core systems by leveraging an entropy-based sensor placement strategy and an adaptive compressive sensing approach. By…
As integrated circuit technologies are moving to smaller technology nodes, Electromigration (EM) has become one of the most challenging problems facing the EDA industry. While numerical approaches have been widely deployed since they can…
One-dimensional Heisenberg spin 1/2 chains with random ferro- and antiferromagnetic bonds are realized in systems such as $Sr_3 CuPt_{1-x} Ir_x O_6$. We have investigated numerically the thermodynamic properties of a generic random bond…