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Integrating artificial intelligence (AI) techniques such as machine learning and deep learning into freeform optics design has significantly enhanced design efficiency, expanded the design space, and led to innovative solutions. This…
Artificial intelligence (AI) has rapidly evolved into a critical technology; however, electrical hardware struggles to keep pace with the exponential growth of AI models. Free space optical hardware provides alternative approaches for…
Recent experimental progress in quantum information processing with trapped ions have demonstrated most of the fundamental elements required to realize a scalable quantum computer. The next set of challenges lie in realization of a large…
With the significant advancements in optical computing platforms recently capable of performing various primitive operations, a seamless integration of optical computing into very fabric of optical communication links is envisioned, paving…
AI/ML for data centres and data centres for AI/ML are defining new trends in cloud computing. Disaggregated heterogeneous reconfigurable computing systems realized by photonic interconnects and photonic switching expect greatly enhanced…
Modern problems in high-performance computing, ranging from training and inferencing deep learning models in computer vision and language models to simulating complex physical systems with nonlinearly-coupled equations, require exponential…
Multimodal artificial intelligence (AI) integrates diverse types of data via machine learning to improve understanding, prediction, and decision-making across disciplines such as healthcare, science, and engineering. However, most…
Integrated photonics based on silicon photonics platform is driving several application domains, from enabling ultra-fast chip-scale communication in high-performance computing systems to energy-efficient optical computation in artificial…
Coherent photonic computing uses both the phase and amplitude of light to implement linear operations such as dot products and matrix multiplication but requires phase stability between the interfering paths. This poses a challenge for such…
Optical I/O technologies have emerged as a potential industrial solution for high-performance data interconnection in AI/ML computing acceleration. While optical I/Os are deployed at the edge of computational chips by co-packaged optics…
Three-dimensional integrated circuit (3D IC) pack-aging and heterogeneous integration have emerged as central pillars of contemporary semiconductor scaling. Yet, the multi-physics coupling inherent to stacked architectures manifesting as…
Optical computing has been recently proposed as a new compute paradigm to meet the demands of future AI/ML workloads in datacenters and supercomputers. However, proposed implementations so far suffer from lack of scalability, large…
Heterogeneous hardware and dynamic workloads worsen long-standing OS bottlenecks in scalability, adaptability, and manageability. At the same time, advances in machine learning (ML), large language models (LLMs), and agent-based methods…
The exponential growth of AI has created unprecedented demand for computational resources, pushing chip designs to the limit while simultaneously escalating the environmental footprint of computing. As the industry transitions toward…
Optics offers unique opportunities for reducing energy in information processing and communications while resolving the problem of interconnect bandwidth density inside machines. Such energy dissipation overall is now at environmentally…
Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…
Artificial intelligence (AI) has emerged as a powerful technology that improves system performance and enables new features in 5G and beyond. Standardization, defining functionality and interfaces, is essential for driving the industry…
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and…
Panel-scale reconfigurable photonic interconnects on a glass substrate up to 500-mm x 500-mm or larger are envisioned by proposing a novel photonic switch fabric that enables all directional panel-edge-to-panel-edge reach without the need…
Inspired by the renaissance of optical computing recently, this poster presents a disruptive outlook on the possibility of seamless integration between optical communications and optical computing infrastructures, paving the way for…