Related papers: Comparative Analysis of SRAM PUF Temperature Susce…
Characterizing plasticity mechanisms below the ductile-to-brittle transition temperature is traditionally difficult to accomplish in asystematic fashion. Here, we use a new experimental setup to perform in situ cryogenic mechanical testing…
Leveraging the latent heat of phase change materials (PCMs) can reduce the peak temperatures and transient variations in temperature in electronic devices. But as the power levels increase, the thermal conduction pathway from the heat…
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…
Field Programmable Gate Array (FPGA)-based embedded systems have become mainstream in the last decade, often in security-sensitive applications. However, even with an authenticated hardware platform, compromised software can severely…
A new global analytical model of the heat dissipation process that occurs in passively-cooled embedded systems is introduced, and we explicit under what circumstances the traditional assumption that exponential cooling laws apply in such…
A strain-insensitive temperature sensor based on multimode interference using standard multimode fibers (MMFs) is proposed according to the comprehensive study of the characteristics of the MMFs. The temperature and strain dependences on…
Security is of critical importance for the Internet of Things (IoT). Many IoT devices are resource-constrained, calling for lightweight security protocols. Physical unclonable functions (PUFs) leverage integrated circuits' variations to…
Disordered photonic structures are promising materials for the realization of physical unclonable functions (PUF), physical objects that can overcome the limitations of conventional digital security methods and that enable cryptographic…
Spin qubits have proven to be a feasible candidate for quantum computation, and some realizations of spin qubits already benefit from advanced device manufacturing in the semiconductor industry. Compared to superconducting platforms, spin…
Modern multiprocessor system-on-chips (SoCs) integrate multiple heterogeneous cores to achieve high energy efficiency. The power consumption of each core contributes to an increase in the temperature across the chip floorplan. In turn,…
The soft error rate (SER) of integrated circuits (ICs) operating in space environment may vary by several orders of magnitude due to the variable intensity of radiation exposure. To ensure the radiation hardness without compromising the…
Scan and ring schemes of the pseudo-ring memory selftesting are investigated. Both schemes are based on emulation of the linear or nonlinear feedback shift register by memory itself. Peculiarities of the pseudo-ring schemes implementation…
Surface temperature measurements were performed with a Scanning Thermal Microscope mounted with a thermoresistive wire probe of micrometrSurface temperature measurements were performed with a Scanning Thermal Microscope mounted with a…
Observing, understanding, and mitigating the effects of failure in embedded systems is essential for building dependable control systems. We develop a software-based monitoring methodology to further this goal. This methodology can be…
This paper presents a set of models dedicated to describe a flash storage subsystem structure, functions, performance and power consumption behaviors. These models cover a large range of today's NAND flash memory applications. They are…
In this work the novel usage of a physically unclonable function composed of a network of Mach-Zehnder interferometers for authentication tasks is described. The physically unclonable function hardware is completely reconfigurable, allowing…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
Modeling attacks, in which an adversary uses machine learning techniques to model a hardware-based Physically Unclonable Function (PUF) pose a great threat to the viability of these hardware security primitives. In most modeling attacks, a…
We investigate usage of nonlinear wave chaotic amorphous silicon (a-Si) cavities as physically unclonable functions (PUF). Machine learning attacks on integrated electronic PUFs have been demonstrated to be very effective at modeling PUF…
Many commercially available memory chips are fabricated worldwide in untrusted facilities. Therefore, a counterfeit memory chip can easily enter into the supply chain in different formats. Deploying these counterfeit memory chips into an…