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Flexible Electronics (FE) offer distinct advantages, including mechanical flexibility and low process temperatures, enabling extremely low-cost production. To address the demands of applications such as smart sensors and wearables, flexible…
High throughput experimental methods are known to accelerate the rate of research, development, and deployment of electronic materials. For example, thin films with lateral gradients in composition, thickness, or other parameters have been…
Network-on-Chip (NoC) paradigm has been proposed as an auspicious solution to handle the strict communication requirements between the increasingly large number of cores on a single multi and many-core chips. However, NoC systems are…
This paper presents a mathematical framework for modeling the dynamic effects of three fault categories and six fault variants in the ink channels of high-end industrial printers. It also introduces a hybrid approach that combines…
Transformer models rely on High-Performance Computing (HPC) resources for inference, where soft errors are inevitable in large-scale systems, making the reliability of the model particularly critical. Existing fault tolerance frameworks for…
3D NAND enables continuous NAND density and cost scaling beyond conventional 2D NAND. However, its poly-Si channel suffers from low mobility, large device variations, and instability caused by grain boundaries. Here, we overcome these…
Integrating In-Ga-Zn-oxide (IGZO) channel transistors in silicon-based ecosystems requires the resilience of the channel material to hydrogen treatment. Standard IGZO, containing 40% In (metal ratio) suffers from degradation under forming…
Fault tolerance in multi-core architecture has attracted attention of research community for the past 20 years. Rapid improvements in the CMOS technology resulted in exponential growth of transistor density. It resulted in increased…
The unique electronic properties of amorphous indium gallium zinc oxide (a-IGZO) thin films are closely associated with the complex charge dynamics of the materials. Conventional studies of charge transport in a-IGZO usually involve…
Fault detection methods have their pros and cons. Thus, it is possible that some methods can complement each other and offer consequently better diagnostic systems. The integration of various characteristics is a way to develop "hybrid"…
The need to digitize signals with intricate spectral characteristics often challenges traditional analog-to-digital converters (ADCs). The recently proposed modulo-ADC architecture offers a promising alternative by leveraging inherent…
Data center hardware refresh cycles are lengthening. However, increasing processor complexity is raising the potential for faults. To achieve longevity in the face of increasingly fault-prone datapaths, fault tolerance is needed, especially…
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D phase, and in general for small-scale applications, such…
Dynamic analysis and especially fuzzing are challenging tasks for embedded firmware running on modern low-end Microcontroller Units (MCUs) due to performance overheads from instruction emulation, the difficulty of emulating the vast space…
The increase in HPC systems size and complexity, together with increasing on-chip transistor density, power limitations, and number of components, render modern HPC systems subject to soft errors. Silent data corruptions (SDCs) are…
In cryptographic engineering, extensive attention has been devoted to ameliorating the performance and security of the algorithms within. Nonetheless, in the state-of-the-art, the approaches for increasing the reliability of the efficient…
Emulation-based fuzzers enable testing binaries without source code, and facilitate testing embedded applications where automated execution on the target hardware architecture is difficult and slow. The instrumentation techniques added to…
Today, most X-ray pixel detectors used at light sources transmit raw pixel data off the detector ASIC. With the availability of more advanced ASIC technology nodes for scientific application, more digital functionality from the computing…
The development of novel transparent conducting materials (TCMs) is essential for enhancing the performance and reducing the cost of next-generation devices such as solar cells and displays. In this research, we focus on the…
The Network-on-Chip (NoC) paradigm has been proposed as a favorable solution to handle the strict communication requirements between the increasingly large number of cores on a single chip. However, NoC systems are exposed to the aggressive…