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Numerical homogenization for mechanical multiscale modeling by means of the finite element method (FEM) is an elegant way of obtaining structure-property relations, if the behavior of the constituents of the lower scale is well understood.…

Numerical Analysis · Mathematics 2025-08-07 Nils Lange , Geralf Hütter , Bjoern Kiefer

Interconnect is one of the main performance determinant of modern integrated circuits (ICs). The new technology of vertical ICs places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to…

Materials Science · Physics 2013-05-15 Abderrazzak El Boukili

The $hp$-adaptive finite element method (FEM) - where one independently chooses the mesh size ($h$) and polynomial degree ($p$) to be used on each cell - has long been known to have better theoretical convergence properties than either $h$-…

Numerical Analysis · Mathematics 2023-09-14 Marc Fehling , Wolfgang Bangerth

Data-driven thermal predictors for 3D-ICs are often trained from scratch for each chip design using many high-fidelity finite-element simulations, leading to high data-generation cost and costly cross-design reuse. We propose Therm-FM, a…

Computational Engineering, Finance, and Science · Computer Science 2026-05-26 Zhen Huang , Haiyang Xin , Wenkai Yang , Yangbo Wei , Zhiping Yu , Yu Zhang , Wei W. Xing , Ting-Jung Lin , Lei He

We have built an integrated computational platform for material properties at extreme conditions, ProME (Professional Materials at Extremes) v1.0, which enables integrated calculations for multicomponent alloys, covering high temperatures…

Partial differential equations can be solved on general polygonal and polyhedral meshes, through Polytopal Element Methods (PEMs). Unfortunately, the relation between geometry and analysis is still unknown and subject to ongoing research in…

Computational Geometry · Computer Science 2022-11-23 Daniela Cabiddu , Giuseppe Patanè , Michela Spagnuolo

Accurate knowledge of temperatures in power semiconductor modules is crucial for proper thermal management of such devices. Precise prediction of temperatures allows to operate the system at the physical limit of the device avoiding…

Signal Processing · Electrical Eng. & Systems 2020-06-15 Jakub Ševčík , Václav Šmídl , Ondřej Straka

Fast and efficient simulations of metal additive manufacturing (AM) processes are highly relevant to exploring the full potential of this promising manufacturing technique. The microstructure composition plays an important role in…

Computational Engineering, Finance, and Science · Computer Science 2024-02-28 Sebastian D. Proell , Julian Brotz , Martin Kronbichler , Wolfgang A. Wall , Christoph Meier

In this work, we extend the meshfree generalized multiscale exponential integration framework introduced in Nikiforov et al. (2025) to the simulation of three-dimensional advection--diffusion problems in heterogeneous and high-contrast…

Efficient exploitation of exascale architectures requires rethinking of the numerical algorithms used in many large-scale applications. These architectures favor algorithms that expose ultra fine-grain parallelism and maximize the ratio of…

Recently, the growing memory demands of embedding tables in Deep Learning Recommendation Models (DLRMs) pose great challenges for model training and deployment. Existing embedding compression solutions cannot simultaneously meet three key…

Machine Learning · Computer Science 2024-03-28 Hailin Zhang , Zirui Liu , Boxuan Chen , Yikai Zhao , Tong Zhao , Tong Yang , Bin Cui

An open source two-dimensional (2D) thermal finite element (FE) model of the Directed Energy Deposition (DED) process is developed using the Python-based FEniCS framework. The model incrementally deposits material ahead of the laser focus…

We develop a sparse multiscale operator-adapted wavelet decomposition-based finite element method (FEM) on unstructured polygonal mesh hierarchies obtained via a coarsening procedure. Our approach decouples different resolution levels,…

Computational Physics · Physics 2025-12-19 Furkan Şık , F. L. Teixeira , B. Shanker

Modern TEM instrumentation can probe a wide range of structural, optical, and chemical properties with unprecedented resolution. However, each of these properties must be recorded in independent datasets using different detector modes with…

Materials Science · Physics 2023-01-16 Thomas Thersleff , Cheuk-Wai Tai

This article proposes a novel high-performance computing approach for the prediction of the temperature field in powder bed fusion (PBF) additive manufacturing processes. In contrast to many existing approaches to part-scale simulations,…

Computational Engineering, Finance, and Science · Computer Science 2023-09-18 Sebastian D. Proell , Peter Munch , Martin Kronbichler , Wolfgang A. Wall , Christoph Meier

Partial Differential Equations (PDEs) are widely used for modeling the physical phenomena and analyzing the dynamical behavior of many engineering and physical systems. The heat equation is one of the most well-known PDEs that captures the…

Logic in Computer Science · Computer Science 2022-08-16 Elif Deniz , Adnan Rashid , Osman Hasan , Sofiène Tahar

Thermal management is a major challenge in next-generation high-performance computing systems, particularly for heterogeneous multi-chip packages such as the NVIDIA GB200 Grace Blackwell Superchip. In this work, a physics-based…

Systems and Control · Electrical Eng. & Systems 2026-05-21 Michael Acquah , Zheng Liu

One of the ultimate goals of computational modeling in condensed matter is to be able to accurately compute materials properties with minimal empirical information. First-principles approaches such as the density functional theory (DFT)…

Atomistic simulations of heat transport in complex materials are costly and hard to converge. This has led to the development of several noise-reduction techniques applicable to equilibrium molecular-dynamics (MD) simulations. We analyze…

Materials Science · Physics 2025-11-19 Sandro Wieser , YuJie Cen , Georg K. H. Madsen , Jesús Carrete

Many thermo-mechanical processes, such as thermal expansion and stress relaxation, originate at the atomistic scale. We develop a sequential multiscale approach to study thermally stressed superelastic polyimide to explore these effects.…

Materials Science · Physics 2025-04-30 Jerome Samuel S , Puneet Kumar Patra , Md Rushdie Ibne Islam