Related papers: ATSim3.5D: A Multiscale Thermal Simulator for 3.5D…
Heat-assisted magnetic recording (HAMR) is a recent advancement in magnetic recording, allowing to significantly increase the areal density capability (ADC) of hard disk drives (HDDs) compared to the perpendicular magnetic recording (PMR)…
In this paper, a multiple-relaxation-time lattice Boltzmann model with an off-diagonal collision matrix was adopted to predict the effective thermal conductivities of the anisotropic heterogeneous materials whose components are also…
The numerical simulation of structural mechanics applications via finite elements usually requires the solution of large-size and ill-conditioned linear systems, especially when accurate results are sought for derived variables interpolated…
This paper considers the problem of temperature regulation in multicore processors by dynamic voltage-frequency scaling. We propose a feedback law that is based on an integral controller with adjustable gain, designed for fast tracking…
3D additive manufacturing enables the fabrication of nanophotonic structures with subwavelength features that control light across macroscopic scales. Gradient-based optimization offers an efficient approach to design these complex and…
We present a novel hybrid incompressible flow/material point method solver for simulating the combustion of flammable solids. Our approach utilizes a sparse grid representation of solid materials in the material point method portion of the…
A modern graphics processing unit (GPU) is able to perform massively parallel scientific computations at low cost. We extend our implementation of the checkerboard algorithm for the two dimensional Ising model [T. Preis et al., J. Comp.…
Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring…
This work summarizes recent progress on the thermal transport properties of three-dimensional (3D) nanostructures, with an emphasis on experimental results. Depending on the applications, different 3D nanostructures can be prepared or…
The rising use of deep learning and other big-data algorithms has led to an increasing demand for hardware platforms that are computationally powerful, yet energy-efficient. Due to the amount of data parallelism in these algorithms,…
High power density systems require efficient cooling to maintain their thermal performance. Despite this, as systems get larger and more complex, human practice and insight may not suffice to determine the desired thermal management system…
Accurately predicting the temperature field in metal additive manufacturing (AM) processes is critical to preventing overheating, adjusting process parameters, and ensuring process stability. While physics-based computational models offer…
3D structure modeling is essential across scales, enabling applications from fluid simulation and 3D reconstruction to protein folding and molecular docking. Yet, despite shared 3D spatial patterns, current approaches remain fragmented,…
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…
A hybrid PIC-fluid model is proposed for three dimensional numerical simulation of laser-plasma interaction. Ions are treated kinetically, electrons as a ten-moment fluid, capturing ion-scale dynamics, pressure anisotropy, and…
Asymmetric heat transfer systems, often referred to as thermal diodes or thermal rectifiers, have garnered increasing interest due to their wide range of application possibilities. Most of those previous macroscopic thermal diodes either…
High-efficient heat dissipation plays critical role for high-power-density electronics. Experimental synthesis of ultrahigh thermal conductivity boron arsenide (BAs, 1300 W m-1K-1) cooling substrates into the wide-bandgap semiconductor of…
Simulating thermal-equilibrium properties at finite temperature is crucial for studying quantum many-body systems. Quantum computers are expected to enable us to simulate large systems at finite temperatures, overcoming challenges faced by…
In this paper we evaluate the use of system identification methods to build a thermal prediction model of heterogeneous SoC platforms that can be used to quickly predict the temperature of different configurations without the need of…
This paper studies the thermal properties of three-terminal mesoscopic dielectric systems in the nonlinear response regime at low temperature. For a symmetric three-terminal system, when the temperature is finitely different between the…