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Laser cutting of semiconductor wafers and transparent dielectrics has become a dominant process in manufacturing industries, encompassing a wide range of applications from flat display panels to microelectronic chips. Limited by the…
The semiconductor chip manufacturing process is complex and lengthy, and potential errors arise at every stage. Each wafer contains numerous chips, and wafer bin maps can be generated after chip testing. By analyzing the defect patterns on…
Semiconductor lasers have been rapidly evolving to meet the demands of next-generation optical networks. This imposes much more stringent requirements on the laser reliability, which are dominated by degradation mechanisms (e.g., sudden…
On-chip coherent laser sources are crucial for the future of photonic integrated circuits, yet progress has been hindered by the complex interplay between material quality, device geometry, and performance metrics. We combine…
Correctly setting the parameters of a production machine is essential to improve product quality, increase efficiency, and reduce production costs while also supporting sustainability goals. Identifying optimal parameters involves an…
Quality control and quality assurance are challenges in Direct Metal Laser Melting (DMLM). Intermittent machine diagnostics and downstream part inspections catch problems after undue cost has been incurred processing defective parts. In…
Discovering novel materials with desired properties is essential for driving innovation. Industry 4.0 and smart manufacturing have promised transformative advances in this area through real-time data integration and automated production…
A growing need exists for efficient and accurate methods for detecting defects in semiconductor materials and devices. These defects can have a detrimental impact on the efficiency of the manufacturing process, because they cause critical…
High-performance semiconductor optoelectronics such as perovskites have high-dimensional and vast composition spaces that govern the performance properties of the material. To cost-effectively search these composition spaces, we utilize a…
This paper addresses the problem of fault diagnosis in multistation assembly systems. Fault diagnosis is to identify process faults that cause the excessive dimensional variation of the product using dimensional measurements. For such…
A generic fast method for object classification is proposed. In addition, a method for dimensional reduction is presented. The presented algorithms have been applied to real-world data from chip fabrication successfully to the task of…
As the globalization of semiconductor design and manufacturing processes continues, the demand for defect detection during integrated circuit fabrication stages is becoming increasingly critical, playing a significant role in enhancing the…
The chips contained in any electronic device are manufactured over circular silicon wafers, which are monitored by inspection machines at different production stages. Inspection machines detect and locate any defect within the wafer and…
Laser wakefield accelerators promise to revolutionise many areas of accelerator science. However, one of the greatest challenges to their widespread adoption is the difficulty in control and optimisation of the accelerator outputs due to…
In the pursuit of sustainable manufacturing, ultra-short pulse laser micromachining stands out as a promising solution while also offering high-precision and qualitative laser processing. However, unlocking the full potential of ultra-short…
Manufacturing advanced materials and products with a specific property or combination of properties is often warranted. To achieve that it is crucial to find out the optimum recipe or processing conditions that can generate the ideal…
Simple mechanical exfoliation of layered materials is the most frequently employed method for producing high-quality monolayers of two-dimensional semiconducting materials. However, the mechanical exfoliation by human hands is a…
This survey paper offers a comprehensive review of methodologies utilizing machine learning (ML) classification techniques for identifying wafer defects in semiconductor manufacturing. Despite the growing body of research demonstrating the…
Toolpath planning is an important task in laser aided additive manufacturing (LAAM) and other direct energy deposition (DED) processes. The deposition toolpaths for complex geometries with slender structures can be further optimized by…
Wire-feed laser additive manufacturing is an emerging fabrication technique capable of highly automated large-scale volume production that can reduce both material waste and overall cost while improving product lead times. Quality assurance…