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This work introduces an electromagnetic metastructure based interconnect design that could address the critical need for electrical bandwidth and heat dissipation in high-speed, chiplet integration. We leverage silicon as the substrate for…
Bulk silicon carbide (SiC) is a very promising material system for bio-applications and quantum sensing. However, its optical activity lies beyond the near infrared spectral window for in-vivo imaging and fiber communications due to a large…
An efficient silicon based light source presents an unreached goal in the field of photonics, due to Silicons indirect electronic band structure preventing direct carrier recombination and subsequent photon emission. Here we utilize…
Understanding the microscopic thermal effects of the hydrogel is important for its application in diverse fields, including thermal-related studies in tissue engineering and thermal management for flexible electronic devices. In recent…
Mid-infrared spectrum is a critical tool for chemical analysis, industrial inspection, environment, and other fields due to its rich chemical bond information. However, the complicated growth or fabrication procedures of existing…
The progress of semiconductor electronics toward ever-smaller length scales and associated higher power densities brings a need for new high-resolution thermal microscopy techniques. Traditional thermal microscopy is performed by detecting…
The primary challenge in silicon photonics is achieving efficient luminescence in the communication band, crucial for its large-scale application. Despite significant efforts, silicon light sources still suffer from low efficiency and…
The emission of thermal radiation is a physical process of fundamental and technological interest. From different approaches, thermal radiation can be regarded either as one of the basic mechanisms of heat transfer, as a fundamental quantum…
Heat capacity measurements under high pressure places high demands on the calorimeter. Here we describe the development of a miniaturized nanocalorimeter for high-pressure heat capacity measurements at low temperature. The device,…
We explore layered strongly correlated materials as a platform to identify and control unconventional heat transfer phenomena. We demonstrate that these systems can be tailored to sustain a wide spectrum of heat transport regimes, ranging…
Optical microcombs generated in high-Q microresonators are promising chip-scale light sources for applications ranging from optical communications to spectroscopy and metrology. However, thermo-optic instabilities remain a major obstacle to…
In recent years, thermal display has been studied intensively in order to represent a more realistic tactile quality of the object. Since human feels the temperature of the air without touching other objects, it is necessary to present…
Expanding far beyond traditional applications in optical interconnects at telecommunications wavelengths, the silicon nanophotonic integrated circuit platform has recently proven its merits for working with mid-infrared (mid-IR) optical…
Virtually all electronic systems try to optimize a fundamental trade-off between higher performance and lower power consumption. The latter becomes critical in mobile computing systems, such as smartphones, which rely on passive cooling.…
Light-emitting electronic devices are ubiquitous in key areas of current technology, such as data communications, solid-state lighting, displays, and optical interconnects. Controlling the spectrum of the emitted light electrically, by…
Superconducting hot-electron bolometers are presently the best performing mixing devices for the frequency range beyond 1.2 THz, where good quality superconductor-insulator-superconductor (SIS) devices do not exist. Their physical…
Porous materials provide a large surface to volume ratio, thereby providing a knob to alter fundamental properties in unprecedented ways. In thermal transport, porous nanomaterials can reduce thermal conductivity by not only enhancing…
Flexoelectricity, an electromechanical coupling between strain gradient and polarization, offers a promising dimension to enrich silicon-based devices. Although the flexoelectricity of silicon is known, some fundamental aspects remain…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
Side channels remain a challenge to information flow control and security in modern computing platforms. Resource partitioning techniques that minimise the number of shared resources among processes are often used to address this challenge.…