Related papers: Multi-diagnostic characterization of inductively c…
Tailoring ion energy distribution function (IEDF) is vital for advanced plasma processing applications. Capacitively coupled plasma (CCP) discharges excited using non-sinusoidal waveform have shown its capability to control IEDF through…
We propose a method to generate a single peak at a distinct energy in the ion flux-energy distribution function (IDF) at the electrode surfaces in capacitively coupled plasmas. The technique is based on the tailoring of the driving voltage…
The highly advanced treatment of surfaces as etching and deposition is mainly enabled by the extraordinary properties of technological plasmas. The primary factors that influence these processes are the flux and the energy of various…
A self-consistent 1-D model was developed to study the effect of the electron energy distribution function (EEDF) on power deposition and plasma density profiles in a planar inductively coupled plasma (ICP) in the non-local regime (pressure…
Inductively Coupled Plasma (ICP) etching of amorphous silicon (a-Si) nanostructures using a continuous C4F8/SF6 plasma over nanotopography in silicon dioxide (SiO2) is investigated. The coil power of the ICP system is used to tune the a-Si…
Using particle-in-cell simulation technique, we investigate the plasma and ionization asymmetry, electron and ion energy distribution function in capacitive discharges excited by tailored waveforms. At a base frequency of 13.56 MHz, three…
The ion energy distribution functions (IEDF) have been measured for a helium atmospheric pressure dielectric barrier discharge jet expanding into the air and impacting a metal or ceramic surface. The plasma jet produces ionization waves as…
Control over plasma asymmetry in a low-pressure capacitively coupled plasma (CCP) discharges is vital for many plasma processing applications. In this article, using the particle-in-cell simulation technique, we investigated the asymmetry…
Customized voltage waveforms composed of a number of frequencies and used as the excitation of radio-frequency plasmas can control various plasma parameters such as energy distribution functions, homogeneity of the ionflux or ionization…
Based on two-dimensional particle-in-cell simulations a novel approach towards Electron Energy Probability Function (EEPF) and plasma chemistry control by Current Waveform Tailoring (CWT) in the coil of inductively coupled discharges is…
The kinetic analyses are quite important when it comes to understand the particle behavior in any device as they start to deviate from continuum nature. In the present study, kinetic simulations are performed using Particle-in-Cell (PIC)…
Experimental results, supported by precise modelling, demonstrate optimisation of a plasma-based injector with intermediate laser pulse energy ($<1$ J), corresponding to a normalised vector potential $a_0 = 2.15$, using ionisation injection…
Ion energy distributions have been determined at the rf-bias electrode in an inductively-coupled acetylene-argon plasma for various substrate bias voltages and frequencies under conditions suitable for film deposition. These are compared…
We have used a combination of numerical modeling and experiments to study carbon etching in the presence of a hydrogen plasma. We model the evolution of a low density EUV-induced plasma during and after the EUV pulse to obtain the energy…
The form of a sheath near a small electrode, with bias changing from below to above the plasma potential is studied using 2D particle-in-cell (PIC) simulations. Five cases are studied: (A) an electrode biased more than the electron…
In atmospheric pressure capacitively coupled microplasma jets, Voltage Waveform Tailoring (VWT) was demonstrated to provide ultimate control of the Electron Energy Distribution Function (EEDF), which allows to enhance and adjust the…
A kinetic ion induced electron emission (IIEE) model for general applications is developed to obtain the emitted electron energy spectrum for a distribution of ion impacts on a metallic surface. We assume an ionization cascade mechanism and…
Ion-assisted surface processes are the basis of modern plasma processing. Ion energy distribution (IED) control is critical for precise material modification, especially in atomic-level technologies such as atomic layer etching. Since this…
We report the existence of an enhanced operating regime for a high-frequency, low-pressure capacitively coupled plasma (CCP) discharge in the presence of a weak magnetic field applied parallel to the electrodes. Our PIC-MCC simulations show…
The electron dynamics and SiO2 etching profile evolution in capacitively coupled Ar/CHF3 plasmas driven by sawtooth-waveforms are investigated based on a one-dimensional fluid/Monte-Carlo (MC) model coupled with an etching profile evolution…