Related papers: Leveraging 3D Technologies for Hardware Security: …

We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it…

Split manufacturing (SM) and layout camouflaging (LC) are two promising techniques to obscure integrated circuits (ICs) from malicious entities during and after manufacturing. While both techniques enable protecting the intellectual…

Industry is moving towards large-scale systems where processor cores, memories, accelerators, etc.\ are bundled via 2.5D integration. These various components are fabricated separately as chiplets and then integrated using an interconnect…

As with most aspects of electronic systems and integrated circuits, hardware security has traditionally evolved around the dominant CMOS technology. However, with the rise of various emerging technologies, whose main purpose is to overcome…

With transistor scaling reaching its limits, interposer-based integration of dies (chiplets) is gaining traction. Such an interposer-based integration enables finer and tighter interconnect pitch than traditional system-on-packages and…

With the globalization of manufacturing and supply chains, ensuring the security and trustworthiness of ICs has become an urgent challenge. Split manufacturing (SM) and layout camouflaging (LC) are promising techniques to protect the…

3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and…

Leveraging 2.5D interposer technology, we advocate the integration of untrusted commodity components/chiplets with physically separate, entrusted logic components. Such organization provides a modern root of trust for secure system-level…

Designers use third-party intellectual property (IP) cores and outsource various steps in the integrated circuit (IC) design and manufacturing flow. As a result, security vulnerabilities have been rising. This is forcing IC designers and…

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…

Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and…

Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet…

Security is an important facet of integrated circuit design for many applications. IP privacy and Trojan insertion are growing threats as circuit fabrication in advanced nodes almost inevitably relies on untrusted foundries. A proposed…

Future complementary metal oxide semiconductor (CMOS) scaling for advanced integrated circuit (IC) technologies may well depend on "More than Moore" (MtM) approaches using heterogeneous integration of semiconductor-based devices. In order…

Although it is not a new concept, 3D integration increasingly receives widespread interest and focus as lithographic scaling becomes more challenging, and as the ability to make miniature vias greatly improves. Like Moores law, 3D…

The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-scale VLSI systems with higher energy efficiency in data…

Dedicated, after acceptance and publication, in memory of the late Vassos Soteriou. For the first time, we leverage the 2.5D interposer technology to establish system-level security in the face of hardware- and software-centric adversaries.…

The 3D printing market has experienced significant growth in recent years, with an estimated revenue of 15 billion USD for 2025. Cyber-attacks targeting the 3D printing process whether through the machine itself, the supply chain, or the…

Consumer and defense systems demanded design and manufacturing of electronics with increased performance, compared to their predecessors. As such systems became ubiquitous in a plethora of domains, their application surface increased, thus…

Intellectual Property (IP) infringement including piracy and over production have emerged as significant threats in the semiconductor supply chain. Key based obfuscation techniques (i.e., logic locking) are widely applied to secure legacy…