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A novel approach for creating tool paths for continuous carbon fiber-reinforced thermoplastic 3D printing is introduced. The aim is to enable load-bearing connections while avoiding non-manufacturable crossings of paths by generating layer…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
The ever-increasing size and computational complexity of today's machine-learning algorithms pose an increasing strain on the underlying hardware. In this light, novel and dedicated architectural solutions are required to optimize energy…
While reduction in feature size makes computation cheaper in terms of latency, area, and power consumption, performance of emerging data-intensive applications is determined by data movement. These trends have introduced the concept of…
In recent times, the trend in very large scale integration (VLSI) industry is multi-dimensional, for example, reduction of energy consumption, occupancy of less space, precise result, less power dissipation, faster response. To meet these…
Poor DRAM technology scaling over the course of many years has caused DRAM-based main memory to increasingly become a larger system bottleneck. A major reason for the bottleneck is that data stored within DRAM must be moved across a…
In this article, we present a technology development of a superconducting qubit device 3D-integrated by flip-chip-bonding and processed following CMOS fabrication standards and contamination rules on 200 mm wafers. We present the utilized…
A scalable quantum information processing architecture based on silicon metal-oxide-semiconductor technology is presented, combining quantum hardware elements from planar and 3D silicon-on-insulator technologies. This architecture is…
Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…
For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…
3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal…
Modern chip designs are increasingly complex, making it difficult for developers to glean meaningful insights about hardware behavior while real workloads are running. Hardware introspection aims to solve this by enabling the hardware…
Processing-in-memory (PIM) is a promising computing paradigm to tackle the "memory wall" challenge. However, PIM system-level benefits over traditional von Neumann architecture can be reduced when the memory array cannot fully store all the…
Facilitating the revolution for smarter cities, vehicles are getting smarter and equipped with more resources to go beyond transportation functionality. On-Board Units (OBU) are efficient computers inside vehicles that serve safety and…
Three-dimensional integration technologies such as flip-chip bonding are a key prerequisite to realize large-scale superconducting quantum processors. Modular architectures, in which circuit elements are spread over multiple chips, can…
Bit-level sparsity in neural network models harbors immense untapped potential. Eliminating redundant calculations of randomly distributed zero-bits significantly boosts computational efficiency. Yet, traditional digital SRAM-PIM…
As experimental quantum information processing (QIP) rapidly advances, an emerging challenge is to design a scalable architecture that combines various quantum elements into a complex device without compromising their performance. In…
The introduction of cloud data centres has opened new possibilities for the storage and processing of data, augmenting the limited capabilities of peripheral devices. Large data centres tend to be located away from the end users which…
As both ML training and inference are increasingly distributed, parallelization techniques that shard (divide) ML model across GPUs of a distributed system, are often deployed. With such techniques, there is a high prevalence of…
The many cores design research community have shown high interest in optical crossbars on chip for more than a decade. Key properties of optical crossbars, namely a) contention-free data routing b) low-latency communication and c) potential…