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Electromagnetic crimping is a high-velocity joining method to join highly conductive workpieces where a pulsed magnetic field is applied without any working medium or mechanical contact to deform the workpiece. This work explores…
In this paper, electrothermal field phenomena in electronic components are considered. This coupling is tackled by multiphysical field simulations using the Finite Integration Technique (FIT). In particular, the design of bonding wires with…
Microelectromechanical systems (MEMS) are currently supporting ground-breaking basic research in materials science and metallurgy as they allow in situ experiments on materials at the nanoscale within electron-microscopes in a wide variety…
In our practice as educators, researchers and designers we have found that centering reverse engineering and reuse has pedagogical, environmental, and economic benefits. Design decisions in the development of new hardware tool-kits should…
Among the several flexible thermoelectric modules in existence, sintered Bi-Te-based modules represent a viable option because of their high output power density and flexibility, which enables the use of arbitrary heat sources. We have…
With the increase in the complexity of the materials used in various sophisticated electronic devices, recycling of E-waste is becoming challenging. In the present study, we have converted thermoelectric (TE) waste into functional HER…
In this work we are going to develop a physical model that explains how propulsion may be developed in a vacuum by the collision of electrons with an anode. Instead of using principles related to the conservation of only the mechanical…
Porous electrodes composed of multiphase active materials are widely used in Li-ion batteries, but their dynamics are poorly understood. Two-phase models are largely empirical, and no models exist for three or more phases. Using a modified…
Thermoelectric (TE) air cooling is a solid-state technology that has the potential to replace conventional vapor compression-based air conditioning. In this paper, we present a detailed system-level modeling for thermoelectric air…
Cryo-electron microscopy (cryo-EM) allows for the high-resolution reconstruction of 3D structures of proteins and other biomolecules. Successful reconstruction of both shape and movement greatly helps understand the fundamental processes of…
An electro-chemo-mechanical phase-field formulation is developed to simulate pitting and stress corrosion in polycrystalline materials. The formulation incorporates dependencies of mechanical properties and corrosion potential on…
As computing power demands continue to grow, superconducting electronics present an opportunity to reduce power consumption by increasing the energy efficiency of digital logic and memory. A key milestone for scaling this technology is the…
Freeze-casting produces materials with complex, three-dimensional pore structures which may be tuned during the solidification process. The range of potential applications of freeze-cast materials is vast, and includes: structural…
In this study, we developed a UV-tape-assisted laser patterning (UT-Laser) technique that enables the simple transfer-based formation of wiring with line widths below 200 $\mu$m onto textile substrates. With the rapid advancement of…
The amount of electronic waste (e-waste) recycled worldwide is less than 20% of the total amount produced. In a world where the need for critical and strategic metals is increasing almost exponentially, it is unacceptable that tons of these…
Quantum technology promises revolutionizing applications in information processing, communications, sensing, and modelling. However, efficient on-demand cooling of the functional quantum degrees of freedom remains a major challenge in many…
3D printing enables the fabrication of complex architectures by automating long sequences of additive steps. The increasing sophistication of printers, materials, and generative design promises to make geometric complexity a non-issue in…
Thermoelectric generators (TEGs) based on commercially used thermal super-insulating materials can facilitate sustainable and large-scale ambient waste heat recovery while bequeathing an added economic and environmental value to thermal…
Accurate and efficient circuit behavior modeling is a cornerstone of modern electronic design automation. Among different types of circuits, stiff circuits are challenging to model using previous frameworks. In this work, we propose a new…
The new generation of manufacturing technologies such as e.g. additive manufacturing and automated fiber placement has enabled the development of material systems with desired functional and mechanical properties via particular designs of…