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Partial Differential Equations (PDEs) are fundamental for modeling physical systems, yet solving them in a generic and efficient manner using machine learning-based approaches remains challenging due to limited multi-input and multi-scale…
Most parallel applications suffer from load imbalance, a crucial performance degradation factor. In particle simulations, this is mainly due to the migration of particles between processing elements, which eventually gather unevenly and…
Recently, hardware technology has rapidly evolved pertaining to domain-specific applications/architectures. Soon, processors may be composed of a large collection of vendor-independent IP specialized for application-specific algorithms,…
Large language models (LLMs) such as OpenAI's ChatGPT and Google's Gemini have demonstrated unprecedented capabilities of autoregressive AI models across multiple tasks triggering disruptive technology innovations around the world. However,…
Partitioning graphs into blocks of roughly equal size such that few edges run between blocks is a frequently needed operation when processing graphs on a parallel computer. When a topology of a distributed system is known an important task…
The rapid adoption of chiplet-based heterogeneous integration is reshaping semiconductor design by enabling modular, scalable, and faster time-to-market solutions for AI and high-performance computing. However, multi-vendor assembly in…
In recent years, deep learning models have become ubiquitous in industry and academia alike. Deep neural networks can solve some of the most complex pattern-recognition problems today, but come with the price of massive compute and memory…
Component-based development is a software engineering paradigm that can facilitate the construction of embedded systems and tackle its complexities. The modern embedded systems have more and more demanding requirements. One way to cope with…
Chiplet architectures are on the rise as they promise to overcome the scaling challenges of monolithic chips. A key component of such architectures is an efficient inter-chiplet interconnect (ICI). The ICI design space is huge as there are…
The exponential growth of AI has created unprecedented demand for computational resources, pushing chip designs to the limit while simultaneously escalating the environmental footprint of computing. As the industry transitions toward…
Advanced 2.5D Systems-in-Package (SiPs) compose a growing portion of high-performance systems. While the packaging and interconnect choices play a large role in the overall system design, system architects still lack a suitable framework…
With transistor scaling reaching its limits, interposer-based integration of dies (chiplets) is gaining traction. Such an interposer-based integration enables finer and tighter interconnect pitch than traditional system-on-packages and…
Existing high-end embedded systems face frequent security attacks. Software compartmentalization is one technique to limit the attacks' effects to the compromised compartment and not the entire system. Unfortunately, the existing…
In-memory computing (IMC) on a monolithic chip for deep learning faces dramatic challenges on area, yield, and on-chip interconnection cost due to the ever-increasing model sizes. 2.5D integration or chiplet-based architectures interconnect…
Multi-chiplet architectures enabled by glass interposer offer superior electrical performance, enable higher bus widths due to reduced crosstalk, and have lower capacitance in the redistribution layer than current silicon interposer-based…
Chiplet-based systems, integrating various silicon dies manufactured at different integrated circuit technology nodes on a carrier interposer, have garnered significant attention in recent years due to their cost-effectiveness and…
This article describes a geometric partitioning software that can be used for quick computation of data partitions on many-core HPC machines. It is most suited for dynamic applications with load distributions that vary with time.…
Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-on-Chip (SoC) architectures. Although Moore's Law has been able to…
Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and…
Recent hardware-aware matrix-free algorithms for higher-order finite-element (FE) discretized matrix-vector multiplications reduce floating point operations and data access costs compared to traditional sparse matrix approaches. This work…