Related papers: 3D surface profiling via photonic integrated geome…
We introduce "microdeflectometry", a novel technique for measuring the microtopography of specular surfaces. The primary data is the local slope of the surface under test. Measuring the slope instead of the height implies high information…
We demonstrate a photon-sensitive, three-dimensional camera by active near-infrared illumination and fast time-of-flight gating. It uses pico-second pump pulses to selectively up-convert the backscattered photons according to their…
Active stereo technique using single pattern projection, a.k.a. one-shot 3D scan, have drawn a wide attention from industry, medical purposes, etc. One severe drawback of one-shot 3D scan is sparse reconstruction. In addition, since spatial…
Traditional glass-based optics are typically optimized for narrow spectral bands, such as the visible (400-700nm) or shortwave infrared (1000-1800nm). While the emergence of VIS-SWIR sensors (400-1700nm) offers transformative potential,…
Purpose- High speed image processing is a challenging task for real-time applications such as product quality control of manufacturing lines. Smart image sensors use an array of in-pixel processors to facilitate high-speed real-time image…
The ability to engineer localized surface plasmon resonances at large scale usually relies on precise nanoscale patterning. Here, we demonstrate that mid-infrared plasmonic responses can instead emerge in unpatterned polysilicon films…
Cortical surface registration is a fundamental tool for neuroimaging analysis that has been shown to improve the alignment of functional regions relative to volumetric approaches. Classically, image registration is performed by optimizing a…
In this paper we are extracting surface reflectance and natural environmental illumination from a reflectance map, i.e. from a single 2D image of a sphere of one material under one illumination. This is a notoriously difficult problem, yet…
Efficient fiber-to-chip coupling has been a major hurdle to cost-effective packaging and scalable interconnections of photonic integrated circuits. Conventional photonic packaging methods relying on edge or grating coupling are constrained…
In this work, we use multi-view aerial images to reconstruct the geometry, lighting, and material of facades using neural signed distance fields (SDFs). Without the requirement of complex equipment, our method only takes simple RGB images…
Miniaturized spectrometers employing chip solutions are essential for a wide range of applications, such as wearable health monitoring, biochemical sensing, and portable optical coherence tomography. However, the development of integrated…
The wheel of the train is a 3D revolving geometrical structure. Reconstructing the normal section profile is an effective approach to determine the critical geometric parameter and wear of the wheel in the community of railway safety. The…
In this paper, we propose a novel 3D graph convolution based pipeline for category-level 6D pose and size estimation from monocular RGB-D images. The proposed method leverages an efficient 3D data augmentation and a novel vector-based…
Photonic integrated circuits are gaining traction in the field of telecommunications and information processing for their low-loss and high-throughput data transmission in comparison to electronic integrated circuits. However, they are…
We study the problem of extracting accurate correspondences for point cloud registration. Recent keypoint-free methods bypass the detection of repeatable keypoints which is difficult in low-overlap scenarios, showing great potential in…
The spectra of silicon integrated waveguides are tailored to process analog computing (i.e.,differential and integral) in optical domain with huge bandwidth.With the theory of signal and system, we design some silicon integrated devices to…
Modern computing workloads demand energy-efficient, high-bandwidth interconnects, motivating photonic interposers as an alternative to electrical links. Here we demonstrate a compact 3D silicon nitride (SiN) photonic interposer prototype…
We introduce a novel learning-based method for encoding and manipulating 3D surface meshes. Our method is specifically designed to create an interpretable embedding space for deformable shape collections. Unlike previous 3D mesh…
Efficient fiber-to-chip couplers for multi-port access to photonic integrated circuits are paramount for a broad class of applications, ranging, e.g., from telecommunication to photonic computing and quantum technologies. While…
Face verification is a fast-growing authentication tool for everyday systems, such as smartphones. While current 2D face recognition methods are very accurate, it has been suggested recently that one may wish to add a 3D sensor to such…