Related papers: Qualification of Bump Bonding in CMS Inner Tracker…
The CMS detector at the CERN LHC features a silicon pixel detector as its innermost subdetector. The original CMS pixel detector has been replaced with an upgraded pixel system (CMS Phase-1 pixel detector) in the extended year-end technical…
A prototype of the CMOS pixel sensor named SUPIX-1 has been fabricated and tested in order to investigate the feasibility of a pixelated tracker for a proposed Higgs factory, namely, the Circular Electron-Positron Collider (CEPC). The…
The CMS inner pixel detector system is planned to be replaced during the first phase of the LHC luminosity upgrade. The plans foresee an ultra low mass system with four barrel layers and three disks on either end. With the expected increase…
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about…
Recent advances in CMOS imaging sensor technology , e.g. in CMOS pixel sensors, have proven that the CMOS process is radiation tolerant enough to cope with certain radiation levels required for tracking layers in hadron collider…
During Phase-2 of the LHC, known as the High Luminosity LHC (HL-LHC), the accelerator will increase its instantaneous luminosity to 5 $\times$ 10$^{34}$ cm$^{-2}$ s$^{-1}$, delivering an integrated luminosity of 3000 fb$^{-1}$ over 10 years…
We present the results of x-ray measurements on a hybrid CMOS detector that uses a H2RG ROIC and a unique bonding structure. The silicon absorber array has a 36{\mu}m pixel size, and the readout array has a pitch of 18{\mu}m; but only one…
Following the Phase-II upgrade during Long Shutdown (LS3), the LHC aims to reach a peak instantaneous luminosity of $7.5\times 10^{34}$cm$^{-2}$s$^{-1}$, which corresponds to an average of around 200 inelastic proton-proton collisions per…
Depleted Monolithic Active Pixel Sensors (DMAPS) constitute a promising low cost alternative for the outer layers of the ATLAS experiment Inner Tracker (ITk). Realizations in modern, high resistivity CMOS technologies enhance their…
The radiation hardness of passive CMOS pixel sensors fabricated in 150 nm LFoundry technology is investigated. CMOS process lines are especially of interest for large-scale silicon detectors as they offer high production throughput at…
During the high-luminosity phase of the LHC (HL-LHC), planned to start around 2027, the accelerator is expected to deliver an instantaneous peak luminosity of up to $7.5\times10^{34}$ cm$^{-2}$s$^{-1}$. A total integrated luminosity of…
The LHC machine is planning an upgrade program, which will smoothly bring the instantaneous luminosity to about $5-7.5\times10^{34}~\mathrm{cm}^{-2}\mathrm{s}^{-1}$ in 2028, to possibly reach an integrated luminosity of 3000-4500 fb$^{-1}$…
As part of the Phase II upgrade program, the Compact Muon Solenoid (CMS) detector will incorporate a new timing layer designed to measure minimum ionizing particles (MIPs) with a time resolution of $\sim$30 ps. Precision timing will…
The LHC machine at CERN finished its first year of pp collisions at a center of mass energy of 7 TeV. While the commissioning to exploit its full potential is still ongoing, there are plans to upgrade its components to reach instantaneous…
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel…
CMOS Pixel Sensors tend to become relevant for a growing spectrum of charged particle detection instruments. This comes mainly from their high granularity and low material budget. However, several potential applications require a higher…
During the upcoming High Luminosity phase of the Large Hadron Collider (HL-LHC), the integrated luminosity of the accelerator will increase to 3000 fb$^{-1}$. The expected experimental conditions in that period in terms of background rates,…
This paper presents the design and results of detailed tests of a CMOS active pixel chip for charged particle detection with in-pixel charge storage for correlated double sampling and readout in rolling shutter mode at frequencies up to 25…
In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area…
The performance of novel n-in-p planar pixel detectors, designed for future upgrades of the ATLAS Pixel system is presented. The n-in-p silicon sensors technology is a promising candidate for the pixel upgrade thanks to its radiation…